Low Temperature VECSEL-to-Diamond Heterogeneous Integration with Ag-In Spinodal Nanostructured Layer
Low Temperature VECSEL-to-Diamond Heterogeneous Integration with Ag-In Spinodal Nanostructured Layer
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具有 Ag-In 旋节线纳米结构层的低温 VECSEL 与金刚石异质集成
DOI：
10.2139/ssrn.3708664
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发表时间：
2021
影响因子：
6
通讯作者：
Chin C. Lee
中科院分区：
文献类型：
--
作者：
Roozbeh Sheikhi;Yongjun Huo;F. Shi;Chin C. Lee
金刚石低温异质集成是提高垂直外腔面发射激光器(VECSEL)高功率极限的关键技术。本工作采用改进的Ag-In瞬间液相键合技术，成功地实现了功能强大的VECSEL-金刚石器件。用扫描电子显微镜(SEM)、聚焦离子束(FIB)和高分辨率高角环形暗场扫描电子显微镜(HAADF-STEM)对VECSEL外延膜的键合后质量进行了全面的测试。由于低温工艺，在优化金刚石散热能力的同时，外延层内的热激活扩散和热机械应力被抑制到最低水平。有趣的是，结合实验和热力学证据，首次在Ag-In粘结层中发现了一种与调幅节点分解不同的纳米结构，其结构特征有利于VECSEL-金刚石器件的可靠性。从概念上讲，这项工作开辟了一个新的键合技术类别，即Ag-In调幅键合。
Abstract Low temperature heterogeneous integration with diamond is the key technology in pushing upwards the high-power limit of a vertically-external-cavity surface-emitting laser (VECSEL). This work successfully accomplished a functional high-power VECSEL-to-diamond device with a modified Ag-In transient liquid phase (TLP) bonding technology. The post-bonding quality of VECSEL epitaxial membrane was thoroughly examined with scanning electron microscopy (SEM), focus ion beam (FIB) and high resolution high-angle annular dark-field scanning transmission electron microscopy (HAADF-STEM). Owing to the low-temperature process, thermal-activated diffusion and thermo-mechanical stress have been suppressed to the minimal level within the epitaxial layers while optimizing the heat-spreading capability of the diamond. Interestingly, with experimental and thermodynamic evidences, a distinct nanostructure from spinodal decomposition has been discovered in the Ag-In bonding layer for the first time, whose structural feature is beneficial to the reliability of a VECSEL-to-diamond device. Conceptually, this work opens a new bonding technology category, i.e., Ag-In spinodal bonding.