Effect of additive and current mode on surface morphology of palladium films from a non-aqueous deep eutectic solution (DES)
Effect of additive and current mode on surface morphology of palladium films from a non-aqueous deep eutectic solution (DES)
复制标题
DOI：
10.1007/s10800-013-0608-4
复制
发表时间：
2013-08
影响因子：
2.9
通讯作者：
R. Böck;G. Lanzinger;R. Freudenberger;T. Mehner;D. Nickel;I. Scharf;T. Lampke
中科院分区：
文献类型：
--
作者：
R. Böck;G. Lanzinger;R. Freudenberger;T. Mehner;D. Nickel;I. Scharf;T. Lampke
采用直流电和脉冲电沉积方法，在氯化胆碱/尿素/氯化钯（II）非水电解液中进行了钯的电沉积。在这项研究中，一种有机添加剂（烟酸酰胺），电流模式（直流或脉冲电流沉积）和流体动力学上的电镀钯膜的表面形貌的影响进行了研究。为了确定电沉积钯层的表面形态和厚度，使用扫描电子显微镜和能量色散X射线荧光光谱仪。此外，记录并分析了不同电沉积实验期间的槽电压。实验结果表明，添加剂的加入和脉冲电流对钯镀层的表面形貌有显著影响。脉冲电镀和所选择的抑制剂相互干扰，导致钯沉积物的微观结构发生变化（例如平滑化或形成微裂纹）。通过施加脉冲电流或添加适当的抑制剂可以优化钯存款质量。
Electrodeposition of palladium from a non-aqueous electrolyte solution [choline chloride/urea/palladium(II)chloride] has been carried out by direct and pulse current electroplating. In this study, the influence of an organic additive (nicotinic acid amide), current mode (direct current or pulse current deposition) and hydrodynamic on the surface morphology of electroplated palladium films was investigated. In order to determine the surface morphology and thickness of the electrodeposited palladium layers, a scanning electron microscope and an energy dispersive X-ray fluorescence spectroscope were used. In addition, the cell voltage during the different electrodeposition experiments was recorded and analysed. The experimental results showed that the surface morphology of the palladium deposits could be remarkably affected either by addition of the additive or by applying pulse current. Pulse plating and the selected inhibitor mutually interfere with each other, causing changes in the microstructure of the palladium deposits (e.g. smoothening or forming of micro-cracks). It was possible to optimise the palladium deposit quality by applying pulse current or by addition of the appropriate inhibitor.