Transitional Phases at Ceramic–Metal Interfaces: Orthorhombic, Cubic, and Hexagonal Ti‐Si‐Cu‐N Compounds
Transitional Phases at Ceramic–Metal Interfaces: Orthorhombic, Cubic, and Hexagonal Ti‐Si‐Cu‐N Compounds
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陶瓷-金属界面的过渡相:斜方晶系、立方晶系和六方晶系 Ti-Si-Cu-N 化合物
DOI:
10.1111/j.1151-2916.1990.tb06762.x
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发表时间:
1990
影响因子:
3.9
通讯作者:
A. Carim
中科院分区:
文献类型:
--
作者:
A. Carim
Reaction products at the boundary between Si{sub 3}N{sub 4} and Ag-Cu-Ti braze alloy have been characterized by transmission electron microscopy. Beyond the TiN adjoining the Si{sub 3}N{sub 4} substrate is a continuous layer of a previously unreported, orthorhombic Ti-Si-Cu-N compound. Evidence of additional cubic and hexagonal Ti-Si-Cu-N phases is also found; these exist as isolated grains farther from the substrate. The cubic compound is probably an {eta}-type M{sub 6}X phase of the sort observed at other ceramic-metal interfaces. These dilute ceramics, in which metallic constituents dominate, are common transitional phases in ceramic-metal systems.