A Full 3D Printing Method for Monolithic Integration of an Accelerometer and a Force Sensor

A Full 3D Printing Method for Monolithic Integration of an Accelerometer and a Force Sensor
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DOI:
10.1109/mems49605.2023.10052173
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发表时间:
2023-01
期刊:
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)
影响因子:
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通讯作者:
Guandong Liu;Changhai Wang;Kexin Wang;Zhili Jia;Ruiqi Luo;Wei Ma
Guandong Liu;Changhai Wang;Kexin Wang;Zhili Jia;Ruiqi Luo;Wei Ma
中科院分区:
其他
文献类型:
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作者:
Guandong Liu;Changhai Wang;Kexin Wang;Zhili Jia;Ruiqi Luo;Wei Ma

文献摘要

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本文介绍了基于快速3D打印制造方法的加速度计和力传感器的单片集成。使用三重挤出机3D打印机,第一次交替打印绝缘材料,导电材料和牺牲材料,以在一小时内的一步打印过程中制造多功能MEMS器件,而无需任何额外的金属化和组装过程。此外,利用3D打印在构建几何复杂结构中的优势,加速度计和力传感器可以使用TSV(硅通孔)类设计中的垂直馈电线轻松集成在垂直堆叠中,以便多功能设备可以直接安装在PCB基板上作为芯片级封装。多功能器件的性能表明,3D打印传感器可用于实时运动和力监测,以实现个性化定制,单片集成方法在生产各种集成MEMS传感器方面具有潜在的应用。
This paper presents monolithic integration of an accelerometer and a force sensor based on a rapid 3D printing fabrication approach. With a triple-extruder 3D printer, for the first time, an insulating material, a conductive material, and a sacrificial material were printed alternately to fabricate a multifunctional MEMS device in a one-step printing process within an hour and without any additional metallization and assembly processes. Moreover, with the advantage of 3D printing in building geometrically complex structures, the accelerometer and the force sensor were easily integrated in vertical stacking using vertical feedthroughs in a TSV (Through-Silicon Via)-like design so that the multifunctional device could be directly mounted on a PCB substrate as a chip scale package. The performances of the multifunctional device indicate that the 3D printed sensors can be used in real-time motion and force monitoring for personalized customization and the monolithic integration method has potential applications in producing various integrated MEMS sensors.