Fabrication and characterization of 20 nm planar nanofluidic channels by glass-glass and glass-silicon bonding

Fabrication and characterization of 20 nm planar nanofluidic channels by glass-glass and glass-silicon bonding
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DOI:
10.1039/b502809d
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发表时间:
2005-01-01
期刊:
影响因子:
6.1
通讯作者:
Han, JY
Han, JY
中科院分区:
工程技术1区
文献类型:
--
作者:
Mao, P;Han, JY

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我们的特点是玻璃-玻璃和玻璃-硅键合工艺的制造宽,浅的纳米流体通道的深度下降到纳米尺度。玻璃或Si衬底上的纳米通道通过反应离子蚀刻或湿法蚀刻工艺形成,并且通过玻璃-玻璃熔融结合(550 ℃)或阳极结合工艺与另一平坦衬底密封。我们证明,玻璃-玻璃纳米流体通道浅至25 nm,低纵横比为0.0005(深度与宽度),可以实现与开发的玻璃-玻璃键合技术。我们还发现,硅-玻璃纳米流体通道,浅至20 nm,纵横比为0.004,可以可靠地获得与阳极键合技术。密封的纳米流体通道的厚度均匀性通过结合后的横截面SEM分析来确认。结果表明,由于阳极键合和玻璃-玻璃熔融键合工艺,纳米流体通道的深度没有显著变化。
We have characterized glass - glass and glass - Si bonding processes for the fabrication of wide, shallow nanofluidic channels with depths down to the nanometer scale. Nanochannels on glass or Si substrate are formed by reactive ion etching or a wet etching process, and are sealed with another flat substrate either by glass - glass fusion bonding ( 550 degrees C) or an anodic bonding process. We demonstrate that glass - glass nanofluidic channels as shallow as 25 nm with low aspect ratio of 0.0005 ( depth to width) can be achieved with the developed glass - glass bonding technique. We also find that silicon - glass nanofluidic channels, as shallow as 20 nm with aspect ratio of 0.004, can be reliably obtained with the anodic bonding technique. The thickness uniformity of sealed nanofluidic channels is confirmed by cross-sectional SEM analysis after bonding. It is shown that there is no significant change in the depth of the nanofluidic channels due to anodic bonding and glass - glass fusion bonding processes.