Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy
Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy
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DOI：
10.1016/j.matdes.2016.08.007
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发表时间：
2016-11-15
影响因子：
8.4
通讯作者：
Quadir, M. Z.
中科院分区：
文献类型：
--
作者：
Gain, Asit Kumar;Zhang, Liangchi;Quadir, M. Z.
本文研究了环境友好型共晶锡铜(wt.%)焊料在恶劣使用条件下的组织变化及其对性能退化的影响。采用扫描电子显微镜(SEM)、电子背散射衍射仪(EBSD)和透射电子显微镜(TEM)对其进行了详细的显微分析。在该合金中，Cu6Sn5金属间化合物(IMC)颗粒弥散分布在贝塔-锡基合金的晶内和晶界。当合金在150℃下暴露60d时，Cu6Sn5金属间化合物颗粒和锡基组织的尺寸显著增大。结果，电子互连的机械可靠性变得更差。通过测量一系列的电气和机械性能，包括电阻率、杨氏模数、剪切模数、显微硬度和纳米压痕蠕变行为，证实了这一点。时效前后合金的杨氏模数和剪切模数分别下降约10.6%和9.9%，硬度下降约25%。然而，时效处理提高了合金的减振性能。(C)2016爱思唯尔有限公司。保留所有权利。
This paper describes the changes in microstructures and their effects on property degradations in an environmentally friendly eutectic Sn-0.7Cu (wt.%) solder alloy when subjected to harsh service conditions. A thorough microscopy investigation was conducted by scanning electron microscopy (SEM), electron backscattered diffraction (EBSD) and diffraction analysis with transmission electron microscopy (TEM). In the as-received alloy Cu6Sn5 intermetallic compound (IMC) particles are dispersed in the grain interiors and grain boundaries of beta-Sn matrix. When the alloy was exposed for 60 days at 150 degrees C, the size of Cu6Sn5 IMC particles and Sn matrix grains were increased significantly. As a result the mechanical reliability of electronic interconnections turned inferior. This was confirmed by measuring a range of electrical and mechanical properties that include electrical resistivity, Young's moduli, shear moduli, microhardness and nano indentation creep behaviour. A comparison between the as-received and age-treated alloy shows that the degradation in Young's and shear moduli was about 10.6 and 9.9%, respectively, and that in hardness was about 25%. However the age treatment improved the damping property of the alloy. (C) 2016 Elsevier Ltd. All rights reserved.