Soft Punch Through (SPT) - Setting new Standards in 1200V IGBT
Soft Punch Through (SPT) - Setting new Standards in 1200V IGBT
复制标题
软穿通 (SPT) - 为 1200V IGBT 设定新标准
DOI：
--
复制
发表时间：
2000
期刊：
影响因子：
--
通讯作者：
G. Debled
中科院分区：
文献类型：
--
作者：
S. Dewar;S. Linder;C. V. Arx;A. Mukhitinov;G. Debled
工业驱动器市场继续显示出强劲的增长和坚韧的竞争。这个市场的参与者利用他们所有的聪明才智，以便尽可能地找到竞争优势。这种竞争优势部分来自于与供应商的密切互动：无源元件、机械、控制电子，当然还有IGBT模块。在寻求竞争优势时，IGBT可能是决定性的，因为它的许多特性定义了系统设计的关键参数。本文介绍了ABB半导体公司的一种新型1200V IGBT：软穿通（SPT）。该系列芯片用于LoPak模块系列。新的芯片组展示了坚固耐用，低损耗，良好的并行性和软开关边缘。此外，芯片布局经过精心设计，无需内部芯片并联电阻即可实现非常高效和简单的模块结构，并具有非常大的可焊区域和角栅。
The industrial drives market continues to show dynamic growth and tough competition. The players in this market use all their ingenuity in order to find competitive advantage wherever possible. Part of this competitive advantage comes from close interaction with their suppliers: of passive components, mechanics, control electronics and, of course, IGBT modules. When searching for competitive advantage the IGBT can be decisive, because a number of its characteristics define the critical parameters for the system design. This paper introduces a new 1200V IGBT from ABB Semiconductors: the Soft Punch Through (SPT). This line-up of dies is used in the LoPak module range. The new chipset demonstrates ruggedness, lowlosses, good parallelabilty and soft switching edges. In addition the chip layout has been carefully designed to allow very efficient and simple module construction without the need for internal chip paralleling resistors, with a very large bondable area and corner gate.