Self-Propagating Explosive Reactions in Nanostructured AL/NI Multilayer Films Asalocalized Heat Process Technique Formems
Self-Propagating Explosive Reactions in Nanostructured AL/NI Multilayer Films Asalocalized Heat Process Technique Formems
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DOI：
10.1109/memsys.2006.1627792
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发表时间：
2006-05
期刊：
影响因子：
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通讯作者：
T. Namazu;H. Takemoto;H. Fujita;Y. Nagai;S. Inoue
中科院分区：
文献类型：
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作者：
T. Namazu;H. Takemoto;H. Fujita;Y. Nagai;S. Inoue
本文介绍了一种用于MEMS焊接和键合技术的局部加热新技术。纳米结构铝/镍（Al/Ni）多层膜在原子键能降低的驱动下表现出自扩散放热反应。在这项工作中，我们证明了Al/Ni反应膜作为制造MEMS焊料封装的热源的有效性。采用双源直流磁控溅射技术，在控制Al和Ni厚度的条件下沉积了交替层。通过诱导火花，点燃产生足以熔化Au-Sn焊膜的Al/Ni多层膜，从而成功地制造了Au-Sn膜键合MEMS元件。利用Al/Ni多层膜放热反应的局部加热技术在微机电系统中具有广阔的应用前景。
This paper describes a novel local heating technique for MEMS soldering and bonding technologies. Nanostructured aluminum/nickel (Al/Ni) multilayer films show self-propagating exothermic reactions, driven by a reduction in atomic bond energy. In this work, we demonstrate the validity of the Al/Ni reactive films as a heat source in manufacturing MEMS solder packages. Dual-source DC magnetron sputtering was employed to deposit the alternative layers of Al and Ni under controlling their thicknesses. By inducing spark, the Al/Ni multilayer film that generates heat enough to melt Au-Sn solder films is ignited, thereby having succeeded in fabrication of Au-Sn film-bonded MEMS elements. The local heating technique using Al/Ni multilayer film’s exothermic reactions is expected to have the great potential as soldering technologies in MEMS.