Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions
Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions
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DOI：
10.1016/j.actamat.2012.07.063
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发表时间：
2012-10
期刊：
影响因子：
9.4
通讯作者：
M. Park;S. Gibbons;R. Arróyave
中科院分区：
文献类型：
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作者：
M. Park;S. Gibbons;R. Arróyave
采用多相场方法对Cu/Sn/Cu结构中η（Cu 6Sn 5）和ε（Cu 3Sn）在瞬时液相连接条件下的微观结构演变进行了数值研究。通过相关实验研究确定了材料参数和反应条件。从金属间化合物（IMC）晶粒的形貌、η层相对于ε层的生长比例、各层的演化以及各界面的粗糙度等方面对模拟结果进行了分析，并与实验结果进行了比较。此外，通过使用模拟数据表明，当存在液态Sn时，η IMC层的生长占主导地位，并且当液态Sn耗尽时，上层和下层的η晶粒彼此碰撞，此时较大的晶粒继续以较小晶粒为代价而变粗。同时，ε层的生长变得显著并继续增加，直到η层被完全消耗或反应被热抑制。总体而言，发现模拟与IMC晶粒形态的实验具有良好的定性一致性，同时在空间范围和经过的时间范围内，对于每个IMC层的演变以及η层相对于ε层的衍生生长比率，显示出良好的定量一致性。此外，它示出的结果对应于不同的初始Sn层的厚度值表明，IMC演变可以合理地预测在实验研究之前。
The microstructural evolution of η(Cu6Sn5) and ε(Cu3Sn) in a Cu/Sn/Cu structure under transient liquid phase bonding conditions is numerically investigated through the use of the multiphase-field method. The material parameters and reaction conditions were adopted from relevant experimental research. Simulation results were then analyzed and compared with the experiments in terms of morphology of intermetallic compound (IMC) grains, growth ratio of the η layer with respect to the ε layer, evolution of each layer and roughness of each interface. Additionally, it is shown through the use of simulation data that, while liquid Sn is present, the growth of the η IMC layers is dominant and that, upon the exhaustion of liquid Sn, the η grains of the upper and lower layers impinge on one another, at which time the larger grains continue to coarsen at the expense of the smaller grains. Concurrently, the growth of the ε layers becomes significant and continues to increase until the η layer is fully consumed or the reaction is thermally arrested. Overall, the simulations were found to be in good qualitative agreement with experiments for morphology of the IMC grains, while showing good quantitative agreement, in spatial extent and elapsed time frames, for the evolution of each of the IMC layers and the derived growth ratio of the η layer with respect to the ε layer. Furthermore, it is shown that the results corresponding to different thickness values for the initial Sn layer suggest that the IMC evolution can be reasonably predicted in advance of experimental studies.