Modeling of interconnections and isolation within a multilayered ball grid array package

Modeling of interconnections and isolation within a multilayered ball grid array package
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多层球栅阵列封装内的互连和隔离建模

DOI：
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发表时间：
1999
期刊：
影响因子：
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通讯作者：
T. Hongsmatip
T. Hongsmatip
中科院分区：
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文献类型：
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作者：
R. Ito;R. Jackson;T. Hongsmatip

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介绍了一种用于微波应用的多层球栅阵列（BGA）封装的电气建模方法。模型化的封装被划分为层，并为每个层/互连开发了集总电阻电路模型。提出了一种简单的数值计算方法，用于计算层内不同位置处的过渡之间的寄生耦合，并与集总元件模型相结合。通过与测试包的测量值进行比较，验证了该模型。该建模过程对于确定微波频率下BGA封装中低隔离度的原因非常有用。
A procedure is described for the electrical modeling of multilayered ball grid array (BGA) packages for use in microwave applications. The modeled package is divided into layers and a lumped-clement circuit model is developed for each layer/interconnection. A simple numerical method for computing the parasitic coupling between transitions at different locations within a layer is presented and integrated with the lumped-element model. The model is verified by comparison to measurements of a test package. This modeling procedure is useful for determining the cause of low isolation in BGA packages at microwave frequencies.