XC. On tin whiskers
XC. On tin whiskers
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DOI：
10.1080/14786440808520351
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发表时间：
1953-08
期刊：
影响因子：
--
通讯作者：
F. Frank
中科院分区：
文献类型：
--
作者：
F. Frank
总结锡晶须的生长被解释为一个过程，其中晶须表面的氧化产生应力，该应力从主体中拉出连续的金属线。一个机制是由位错在主质量连续周围的晶须的根部。因此，晶须轴应该平行于位错的伯格斯矢量，即晶体中的滑移方向。启动这一过程所需要的只是一个氧化或其他反应气氛，表面上的一个小旋钮和一个位错。增长率的数量级可以令人满意地解释。晶须的基本上均匀的厚度被解释为生长速率随着半径的减小而迅速增加，但是在一定半径以下，该过程失败，因为根部处的拉伸应力使晶须断裂。晶须在很高的弯曲应力作用下产生的角弯曲是一种不寻常的形变双折射。
Summary The growth of tin whiskers is explained as a process in which oxidation of the whisker surface develops a stress which draws out a continuing thread of metal from the main mass. A mechanism is provided by a dislocation in the main mass which travels continuously around the root of the whisker. It then follows that the whisker axis should be parallel to the Burgers vector of the dislocation, i.e. a slip direction in the crystal. All that is needed to start the process is an oxidizing or other reactive atmosphere, a small knob on the surface, and a dislocation. The order of magnitude of the growth rate can be satisfactorily accounted for. The substantially uniform thickness of whiskers is explained because the growth rate increases rapidly with diminution of radius, but below a certain radius the process fails because the tensile stress at the root fractures the whisker. The angular bends produced in whiskers subjected to a very high bending stress is attributed to an unusual kind of deformation twi...