Conductive adhesives for electronics packaging [Book Review]
Conductive adhesives for electronics packaging [Book Review]
复制标题
电子封装用导电胶[书评]
DOI：
10.1109/mei.2003.1192038
复制
发表时间：
2003
影响因子：
2.9
通讯作者：
K. Schoch
中科院分区：
文献类型：
--
作者：
K. Schoch
基于热塑性塑料的共混物和复合材料的性能定制 I. Chodak 和 I. Lacik，编辑。 Wiley-VCH PO Box 101161 D-69451 Weinheim, 德国 www.wiley-vch.de/home 357 页。 € 159 本书基于 2000 年举行的第 14 届布拉迪斯拉发国际改性聚合物会议上发表的论文。几篇论文讨论了填充炭黑或导电聚吡咯的聚烯烃的性能。它们描述了导电复合材料的电气和机械性能的稳定性以及低填料含量复合材料的介电性能。其他论文比较了各种聚合物中的炭黑复合材料，并报告了镍填料在聚合物涂层中的影响。书中还有许多其他论文涉及各种聚合物共混物，我们的读者可能会感兴趣。 —K.F.小肖赫
Property Tailoring of Thermoplastics—Based Blends and Composites I. Chodak and I. Lacik, Eds. Wiley-VCH PO Box 101161 D-69451 Weinheim, Germany www.wiley-vch.de/home 357 pp. € 159 This book is based on papers presented at the 14th Bratislava International Conference on Modified Polymers, held in 2000. Several papers discuss the properties of polyolefins filled with carbon black or conductive poly(pyrrole). They describe the stability of electrical and mechanical properties of conductive composites, dielectric properties of lowfiller-content composites. Other papers compare composites of carbon black in a variety of polymers, and report effects of nickel filler in polymeric coatings. There are many other papers in the book relating to a wide variety of polymer blends, which may be of interest to our readers. —K.F. Schoch, Jr.