Self-healing effects by the Ce-rich precipitations on completing defective boundaries to manage microstructures and oxidation resistance of Ni-CeO2 coatings
Self-healing effects by the Ce-rich precipitations on completing defective boundaries to manage microstructures and oxidation resistance of Ni-CeO2 coatings
复制标题
富 Ce 沉淀对完善缺陷边界的自修复作用,以管理 Ni-CeO2 涂层的微观结构和抗氧化性
DOI:
10.1016/j.surfcoat.2017.02.024
复制
发表时间:
2017-04
影响因子:
5.4
通讯作者:
Ouyang Chun
中科院分区:
文献类型:
--
作者:
Zhou Xiaowei;Ouyang Chun
This paper presented an effective approach for electroplating of coatings on the activated surface of pure Ti substrate using pulsed electro deposition. Regarding the ceramic-like TiO2barrier layer on its surface of Ti substrate to inhibit surface activity, a novel activating solution that composed of HF, HCl, Ce(NO3)2, TiCl3, and bal. DMF dissolvent was applied for surface modifications of Ti substrate in order to increase interfacial bonding strength of surface Ni coatings. Besides a comparative study of Ni nanocrystalline coatings without and with CeO2addition was carried out for disclosing the role of the Ce-rich phase on managing microstructure and high-temperature oxidation resistance during oxidation at 800 or 1000 °C. Results indicated that Ce-rich precipitations, where dispersed along grain boundaries (GBs), were favorable for completing the spalling oxide-layers on Ni-CeO2nanocomposite coatings during oxidation at 800 °C. Furthermore, an analytical modeling was validated for better understanding of Ce-rich precipitations along GBs defects for monitoring oxidation mechanisms. Furthermore, this finding would be therefore leading to the guidelines for Ce-rich precipitations on the strengthening of Ni-based superalloys.
登录
查看更多内容
影响因子:
6
作者:
Y. Zhou;X. Peng;Fu-Xin Wang
通讯作者:
Y. Zhou;X. Peng;Fu-Xin Wang
影响因子:
5.4
作者:
Xiaowei Zhou;Yifu Shen
通讯作者:
Xiaowei Zhou;Yifu Shen
影响因子:
5.4
作者:
I. Tudela;Yi Zhang;M. Pal;I. Kerr;A. Cobley
通讯作者:
I. Tudela;Yi Zhang;M. Pal;I. Kerr;A. Cobley
影响因子:
6.3
作者:
陈镜昌;曲宁松;朱荻
通讯作者:
朱荻
影响因子:
5.4
作者:
Y. Xue;Hong Bin Liu;Ming-Ming Lan-Ming;Jishun Li;Hang Li
通讯作者:
Y. Xue;Hong Bin Liu;Ming-Ming Lan-Ming;Jishun Li;Hang Li