An analysis of deformation mechanism in the Si3N4-AgCuTi + SiCp-Si3N4 joints by digital image correlation
An analysis of deformation mechanism in the Si3N4-AgCuTi + SiCp-Si3N4 joints by digital image correlation
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DOI：
10.1016/j.jeurceramsoc.2012.07.038
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发表时间：
2013-01-01
影响因子：
5.7
通讯作者：
Li, Xiaodong
中科院分区：
文献类型：
--
作者：
He, Yanming;Sun, Yong;Li, Xiaodong
复合钎料具有传统钎料无法比拟的优点，已被广泛应用于陶瓷与金属的连接。然而，关节中潜在的形成和强化机制仍然不确定。在目前的研究中，将SiCp(p=颗粒)添加到用于连接Si3N4陶瓷的Ag-Cu-Ti钎料中。采用纳米压痕法研究了钎料与SiCp之间反应相的力学性能。提出了一种新的形成机理模型。此外，还首次将光学显微镜(OM)与数字图像相关(DIC)技术相结合，研究了含和不含碳化硅接头的变形机制。认为SiCp的传荷能力、钎焊层的塑性松弛和复合钎料的热膨胀系数降低是导致钎焊接头强化的主要原因。(C)2012爱思唯尔有限公司。保留所有权利。
The composite filler shows more advantages than traditional brazing alloys, and has been widely introduced into joining ceramics or ceramics to metals. However, the underlying formation and strengthening mechanisms remained uncertain in the joint. In current research, SiCp (p = particle) was incorporated in Ag-Cu-Ti brazing alloy for joining Si3N4 ceramic. Nanoindentation method was introduced for probing the mechanical properties of reaction phases between the brazing alloy and SiCp. A novel formation mechanism model was thus proposed. In addition, optical microscope (OM) in conjunction with digital image correlation (DIC) techniques has been first applied to elucidate the deformation mechanism in the joint with and without SiC incorporation. The following reasons were believed to strengthen the brazed joint: load-transfer ability of SiCp, plastic relaxation in the brazing layer and CTE reduction of the composite filler. (C) 2012 Elsevier Ltd. All rights reserved.