Microstructural characterization of Si3N4/42CrMo joint brazed with Ag-Cu-Ti plus TiNp composite filler
Microstructural characterization of Si3N4/42CrMo joint brazed with Ag-Cu-Ti plus TiNp composite filler
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Ag-Cu-Ti+TiNp复合填料钎焊Si3N4/42CrMo接头的显微组织表征
DOI：
10.1016/j.jallcom.2015.08.138
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发表时间：
2015
影响因子：
6.2
通讯作者：
Zhang Jie
中科院分区：
文献类型：
--
作者：
Wang Tianpeng;Ivas Toni;Leinenbach Christian;Zhang Jie
采用添加TiN颗粒的Ag-Cu-Ti钎料对Si 3 N4陶瓷与42 CrMo钢进行了连接，并利用SEM、EDS、XRD和TEM等分析手段对接头的形成机理进行了研究。显微组织分析表明，TiN + Ti 5Si 3反应层与Si 3 N4陶瓷相邻，而42 CrMo/填料反应层中形成了晶粒尺寸为50 ~ 100 nm的无规取向TiC。Ag-Cu-Ti钎料与TiNp的结合紧密，Ti向TiNp扩散并富集。在颗粒表面形成了一层亚化学计量比的TiN 1 −xis纳米薄层。低TiNp含量的钎料钎焊焊缝中只有少量的Cu-Ti金属间化合物析出，而高TiNp含量的钎料钎焊焊缝中析出的Cu-Ti金属间化合物种类繁多。
Ag–Cu–Ti filler alloy incorporated with TiN particles was used to join the Si3N4ceramic to 42CrMo steel, and the formation mechanism of the joint was revealed using SEM, EDS, XRD and TEM investigations. Microstructural examination showed that TiN + Ti5Si3reaction layer is adjacent to the Si3N4ceramic, whereas randomly oriented TiC with grain sizes ranging from 50 to 100 nm form in the 42CrMo/filler reaction layer. The Ag–Cu–Ti brazing alloy exhibits intimate bonding with TiNp, as Ti diffuses towards and enriches around TiNp. A nanometer thin layer of hypostoichiometric TiN1−xis formed at the surface of the particles. Only a small amount of Cu–Ti intermetallic compounds is found in the seam brazed with composite filler of lower TiNp content, whereas various and numerous Cu–Ti intermetallic phases precipitate at higher TiNp content.