Analytical study and compensation for temperature drifts of a bulk silicon MEMS capacitive accelerometer
Analytical study and compensation for temperature drifts of a bulk silicon MEMS capacitive accelerometer
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体硅 MEMS 电容式加速度计温度漂移的分析研究和补偿
DOI：
10.1016/j.sna.2016.01.026
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发表时间：
2016-03-01
影响因子：
4.6
通讯作者：
Zhou, Wu
中科院分区：
文献类型：
--
作者：
He, Jiangbo;Xie, Jin;Zhou, Wu
提出了体硅 MEMS 电容式加速度计偏置和比例因子温度漂移的分析研究和补偿结构。基于热变形和刚度温度依赖性的分析结果，建立了偏置温度漂移（TDB）和比例因子温度漂移（TDSF）的分析模型。模型显示TDB仅由热变形引起，而TDSF由分别由刚度温度依赖性和热变形引起的两部分组成。两部分分别为正和负，但第二部分的绝对值更大。 TDSF 的第一部分可以通过高掺杂来减少。 TDB 和 TDSF 的第二部分都可以通过软粘合剂芯片附着或增加基板厚度来减少。在硅结构中，可以通过敏感方向移动电极的中间定位锚或减小弹簧刚度不对称性来减少TDB，而敏感方向固定电极的中间定位锚可以减少TDSF的第二部分。通过移动电极和固定电极的中间定位锚，设计了温度补偿结构，以减少TDB和TDSF的第二部分。因此，通过使TDSF的两部分相互抵消来减少TDSF。实验结果表明，TDB 从 1.85 mg/℃ 抑制到 0.52 mg/℃，而 TDSF 从 -162.7 ppm/℃ 抑制到 -50.8 ppm/℃。 (C) 2016 Elsevier B.V. 保留所有权利。
An analytical study and a compensation structure for temperature drifts of bias and scale factor of a bulk silicon MEMS capacitive accelerometer are presented. The analytical model for the temperature drift of bias (TDB) and temperature drift of scale factor (TDSF) is established based on the analysis results of thermal deformation and stiffness temperature dependence. The model shows that TDB is only caused by thermal deformation, while TDSF consists of two parts caused by stiffness temperature dependence and thermal deformation, respectively. The two parts are positive and negative, respectively, but the second part has greater absolute value. First part of TDSF can be reduced by high doping. TDB and second part of TDSF can be both reduced by soft adhesive die attaching or increasing substrate thickness. In silicon structure, TDB can be reduced by middle-locating anchors for moving electrodes in sensitive direction or decreasing the stiffness asymmetry of springs, while second part of TDSF can be reduced by middle-locating anchors for fixed electrodes in sensitive direction. By middle-locating anchors both for moving electrodes and fixed electrodes, a temperature compensation structure is designed to reduce TDB and second part of TDSF. Consequently, TDSF is reduced by making the two parts of TDSF cancel each other. Experimental results show that TDB is suppressed from 1.85 mg/degrees C to 0.52 mg/degrees C, while TDSF from -162.7 ppm/degrees C to -50.8 ppm/degrees C. (C) 2016 Elsevier B.V. All rights reserved.