Etching Characteristics of Silicon and its Compounds by Gas Plasma
Etching Characteristics of Silicon and its Compounds by Gas Plasma
复制标题
硅及其化合物的气体等离子体刻蚀特性
DOI:
10.1143/jjap.12.154
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发表时间:
1973
期刊:
影响因子:
--
通讯作者:
T. Enomoto
中科院分区:
文献类型:
--
作者:
H. Abe;Y. Sonobe;T. Enomoto