Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory
Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory
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DOI：
10.1002/adma.201602339
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发表时间：
2016-10-12
影响因子：
29.4
通讯作者：
Lee, Keon Jae
中科院分区：
文献类型：
--
作者：
Kim, Do Hyun;Yoo, Hyeon Gyun;Lee, Keon Jae
超薄硅基柔性16 x 16 NAND闪存（f-NAND）采用卷到板封装。各向异性导电膜（ACF）的基于辊的热压结合将f-NAND转移并同时互连在柔性印刷电路板上。16 x 16 f-NAND的可靠电路运行被证实具有出色的灵活性和稳定的ACF互连。
Ultrathin silicon-based flexible 16 x 16 NAND flash memory (f-NAND) is demonstrated utilizing roll-to-plate packaging. The roll-based thermo-compression bonding of the anisotropic conductive film (ACF) transfers and simultaneously interconnects the f-NAND on a flexible printed circuit board. Reliable circuitry operation of the 16 x 16 f-NAND is confirmed with excellent flexibility and stable ACF interconnections.