High-Performance Polyimide Filaments and Composites Improved by O2 Plasma Treatment

High-Performance Polyimide Filaments and Composites Improved by O2 Plasma Treatment
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通过 O2 等离子体处理改进的高性能聚酰亚胺长丝和复合材料

DOI:
10.3390/polym10070695
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发表时间:
2018-07-01
期刊:
影响因子:
5
通讯作者:
Chen, Nanliang
Chen, Nanliang
中科院分区:
工程技术3区
文献类型:
--
作者:
Lin, Fangbing;Li, Wei;Chen, Nanliang

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在高性能纤维增强复合材料中,界面问题是亟待解决的问题。在这项研究中,提出了不同时期的氧等离子体处理来修饰无扭转聚酰亚胺(PI)长丝,以改善亲水性和力学性能和界面性能。注入氧气会产生化学活性颗粒,通过化学反应和物理蚀刻来修饰灯丝表面。根据x射线光电子能谱(XPS)结果,经过180 s氧等离子体处理后,PI丝的O/C原子比增加了87.16%,C - O官能团增加了135.71%。原子力显微镜(AFM)结果表明,处理后的PI丝的均方根粗糙度(Rq)从38.41 nm提高到78.87 nm,提高了105.34%。O2等离子体处理后,由于表面氧官能团的增加和粗糙度的增加,处理后的PI丝与水的接触角从原始状态的105.08°急剧减小到56.15°。O2等离子体处理的PI长丝也表现出比原始PI长丝更好的机械性能。O2等离子体处理后,聚酰亚胺/聚酰胺酸(PI/PAA)自增强复合材料的粘结性增强,抗拉强度由136 MPa提高到234 MPa,甚至使复合材料的破坏模式由粘结破坏变为部分粘结破坏。
Interface issues urgently need to be addressed in high-performance fiber reinforced composites. In this study, different periods of O2 plasma treatment are proposed to modify twist-free polyimide (PI) filaments to improve hydrophilicity and mechanical and interfacial properties. Feeding O2 produces chemically active particles to modify the filament surface via chemical reactions and physical etching. According to the X-ray photoelectron spectroscopy (XPS) results, the PI filaments exhibit an 87.16% increase in O/C atomic ratio and a 135.71% increase in the C–O functional group after 180 s O2 plasma treatment. The atomic force microscope (AFM) results show that the root mean square roughness (Rq) of the treated PI filaments increases by 105.34%, from 38.41 to 78.87 nm. Owing to the increased surface oxygenic functional groups and roughness after O2 plasma treatment, the contact angle between treated PI filaments and water reduces drastically from the pristine state of 105.08° to 56.15°. The O2 plasma treated PI filaments also demonstrate better mechanical properties than the pristine PI filaments. Moreover, after O2 plasma treatment, the adhesion between PI filaments and poly(amic acid) (PAA) is enhanced, and the tensile strength of the polyimide/poly(amic acid) (PI/PAA) self-reinforced composites increases from 136 to 234 MPa, even causing the failure mode of the composite changes from adhesive failure to partly cohesive failure.