Research on Contamination Deposition Characteristics of Post Insulator Based on Computational Fluid Dynamics
Research on Contamination Deposition Characteristics of Post Insulator Based on Computational Fluid Dynamics
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发表时间：
2015
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通讯作者：
W. Limin
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作者：
W. Limin
为了研究影响绝缘子污秽沉积的因素，我们收集了一些支柱绝缘子的尺寸，并建立了数值模型进行风洞模拟。根据计算流体力学理论，讨论了影响绝缘子陷落质量的四个因素。结果表明，颗粒浓度与绝缘子表面的粘接质量呈线性关系。较高的风速会导致绝缘子顶面和底面都有更多的滞留质量，尽管顶面和底面的不同轮廓会导致不同的倾向。同时，颗粒平均直径的增大会增加顶部表面的捕获质量，但对底部表面几乎没有影响。此外，对于任何形状的绝缘子，增大绝缘子棒直径都会显著降低污秽沉积密度。进一步的对比表明，模拟结果与已报道的一些风洞试验数据有较大差异，这可能是由于模拟中没有充分考虑粘着效应所致。
In order to study the factors influencing insulators' contamination deposition, we gathered the dimensions of some post insulators and set up numerical models for wind tunnel simulation. On the basis of the theory of computational fluid dynamics, we discussed four factors that affect the trapped mass of insulators. It is concluded that the concentration of particles has a linear function on the taped mass of the insulator surface. Higher wind velocity will lead to more trapped mass on both the top surfaces and the bottom surfaces of insulators, though different profiles of the top and bottom surfaces can result in distinct tends. Meanwhile, growth in the mean diameter of particles will increase the trapped mass of the top surfaces but barely affects the bottom surface. Moreover, for any certain shape of insulator, increasing the diameter of insulator rod significantly will reduce the density of contamination deposition. Further comparison indicates a considerable difference between the simulation results and some reported experimental data from wind tunnel tests, which is probably due to the insufficient consideration of the adhesion effect in the simulations.