Heat transfer in injection molding for reproduction of sub-micron-sized features
Heat transfer in injection molding for reproduction of sub-micron-sized features
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DOI：
10.1007/s00170-007-1343-y
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发表时间：
2008-01
期刊：
影响因子：
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通讯作者：
Masayuki Nakao;Kensuke Tsuchiya;T. Sadamitsu;Y. Ichikohara;T. Ohba;T. Ooi
中科院分区：
文献类型：
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作者：
Masayuki Nakao;Kensuke Tsuchiya;T. Sadamitsu;Y. Ichikohara;T. Ohba;T. Ooi
利用微型热流传感器对注射成型过程中的传热进行了定量测量。用聚焦离子束在镀镍模具上刻蚀了0.1-10微米宽、纵横比为0.5-1.0的微槽。在注射后的短时间内，模具内的热流密度达到最大值，达到10~50W/cm~2，塑料与模具之间的换热系数，PMMA为0.27W/(cm~2K)，PS为0.085 W/(cm~2K)。注射后模具表面的最高温度应高于塑料的玻璃化转变温度，然后再生成亚微米宽的微脊。
Heat transfer in injection molding was quantitatively measured with micro heat-flux sensors. The 0.1–10 micron-wide micro-grooves with aspect ratios of 0.5–1.0 were etched by focus ion beam on a Ni-plated mold. During the short time just after injecting, heat-flux in the mold was maximized to 10–50 W/cm2, and heat transfer coefficient between plastic and mold was 0.27 W/(cm2K) with PMMA and 0.085 W/(cm2K) with PS. The maximum mold surface temperature just after injecting should be above the glass transition temperature of plastic, then reproducing sub-micron-wide micro-ridges.