Creep Behavior of a Solder Paste With Bi Addition

Creep Behavior of a Solder Paste With Bi Addition
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添加 Bi 的焊膏的蠕变行为

DOI：
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发表时间：
2017
期刊：
影响因子：
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通讯作者：
J. C. Teixeira
J. C. Teixeira
中科院分区：
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文献类型：
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作者：
P. Ribeiro;D. Soares;M. Cerqueira;S. Teixeira;D. Barros;J. C. Teixeira

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作者对葡萄牙研究和技术发展激励制度的支持表示感谢。联合推广项目ner 002814/2015 (iFACTORY 2015-2018)。这项工作由 FCT 和参考项目 UID/EEA/04436/2013 提供支持，由 FEDER 基金通过 COMPETE 2020 – Programa Operacional Competitividade e Internacionalizacao (POCI) 和参考项目 POCI-01-0145-FEDER-006941 提供支持。这项工作由 FCT 的战略项目 UID/SEM/04077/2013 资助； PEst2015-2020，参考号 UID/CEC/00319/2013 和 UID/FIS/04650/2013。
The authors would like to express his acknowledgments for the support given by the Portugal Incentive System for Research and Technological Development. Project in co-promotion ner 002814/2015 (iFACTORY 2015-2018). This work is supported by FCT with the reference project UID/EEA/04436/2013, by FEDER funds through the COMPETE 2020 – Programa Operacional Competitividade e Internacionalizacao (POCI) with the reference project POCI-01-0145-FEDER-006941. This work was financed by FCT, under the Strategic Project UID/SEM/04077/2013; PEst2015-2020 with the reference UID/CEC/00319/2013 and UID/FIS/04650/2013.