Investigation on Surge Current Capability of 4H-SiC Trench-Gate MOSFETs in Third Quadrant Under Various VGS Biases
Investigation on Surge Current Capability of 4H-SiC Trench-Gate MOSFETs in Third Quadrant Under Various VGS Biases
复制标题
DOI:
10.1109/jestpe.2020.3028094
复制
发表时间:
2021-10-01
影响因子:
5.5
通讯作者:
Sheng, Kuang
中科院分区:
文献类型:
--
作者:
Zhu, Zhengyun;Xu, Hongyi;Sheng, Kuang
In this work, third-quadrant I-V characterization and surge current tests are carried out on SiC asymmetric-trench MOSFET (DUT A) and SiC double-trench MOSFET (DUT B) under various gate-source biases (V-GS). The surge capability is found to be uninfluenced by V-GS for DUT A. However, it has a 71.4% increase when V-GS changes from 0 to -5 V for DUT B. The I-V characteristics in the third quadrant are measured under various V-GS. It is found that the channel is open when the source-drain voltage is >2.5 V for DUT A and >1.5 V for DUT B at V-GS = 0 V. High-temperature measurements are also conducted from 298 K to 448 K. When V-GS = 0 V, the channel current takes up to 50% at 10-A source-to-drain current for DUT B, whereas only 10% for DUT A. This could lead to high current/heat density in the channel of DUT B. The transient resistance is also extracted from the surge I-V trajectories, and it is higher for DUT B tested under V-GS = 0 V, which will increase the dissipated surge energy. Finally, the failure mechanism is analyzed. For DUT A, aluminum melting contributes to the failure at V-GS = -5 V and V-GS = 0 V. For DUT B tested at V-GS = 0 V, the earlier breakdown happens due to gate oxide failure.