Deformation and Bond-Area Expansion of Thick Aluminum Wire during Ultrasonic Bonding
Deformation and Bond-Area Expansion of Thick Aluminum Wire during Ultrasonic Bonding
复制标题
超声波焊接过程中粗铝线的变形和焊接面积扩展
DOI：
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发表时间：
2013
期刊：
影响因子：
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通讯作者：
Yasuo Takahashi
中科院分区：
文献类型：
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作者：
M. Maeda;Yasuo Takahashi
通过超声波焊接将粗铝线与 Al-Si、Si 和 SiO 2 基板焊接在一起，并使用高速测量系统同时详细研究变形和粘合区域扩展行为。通过施加键合力而引起的线的变形立即完成。通过施加超声波振动重新开始变形。施加结合力引起的变形仅由弹性成分组成，而超声波振动引起的变形仅由塑性成分组成。 Al线不会因施加超声波振动期间的塑性变形而加工硬化。粘附区域在垂直于超声波振动的方向上扩大。线变形行为的演变和粘附区域的扩展显示出彼此密切的相关性。
Thick Al wires were welded with Al-Si, Si and SiO 2 substrates by ultrasonic bonding to investigate the deformation and the bond-area expansion behavior simultaneously in detail with a high-speed measuring system. The deformation of the wire by the application of the bonding force is completed immediately. The deformation restarts by the application of the ultrasonic vibration. The deformation induced by applying the bonding force consists of only an elastic component, whereas that by ultrasonic vibration consists of only a plastic component. The Al wire is not work-hardened by the plastic deformation during application of ultrasonic vibration. The adhered area expands in the direction perpendicular to the ultrasonic vibration. The evolution of the wire deformation behavior and the expansion of the adhered area show an intimate correlation with each other.