Toughness of hard nanostructured ceramic thin films
Toughness of hard nanostructured ceramic thin films
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DOI：
10.1016/j.surfcoat.2006.07.020
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发表时间：
2007-02-26
影响因子：
5.4
通讯作者：
Jirout, M.
中科院分区：
文献类型：
--
作者：
Musil, J.;Jirout, M.
本文报道了用微压痕法研究了厚度为3-5微米的硬质、3-5微米厚的磁控溅射纳米结构薄膜的开裂情况。这项研究的主要目的是确定薄膜的开裂、其结构和力学性能之间的相互关系，并评估薄膜的韧性。详细研究了裂纹的形成、薄膜和衬底的力学性能、薄膜的结构以及薄膜生长过程中产生的宏观应力a之间的关系。结果表明，薄膜的抗裂性随H-f(3)/E-f*(2)的增大而增大。结果表明：(1)要正确评价薄膜的韧性，必须将薄膜/衬底作为一个整体来考察，因为衬底的力学性能对裂纹的形成起着决定性的作用；(2)影响裂纹形成的最强参数是薄膜结构及其宏观应力α；(3)具有X射线非晶态结构和小压缩宏观应力(Sigma约为-0.1 Gpa)的纳米结构薄膜即使在薄膜硬度高于20 Gpa的高值情况下也能非常稳定地防止裂纹的发生。(C)2006爱思唯尔B.V.保留所有权利。
This article reports on the investigation of cracking of hard, 3-5 mu m thick Zr-Cu-0, Zr-Cu-C, Ti-Cu-C and Si-Me-N (Me = Ta, Zr, Mo, W) magnetron sputtered nanostructured films using microindentation measurements. Main aim of this investigation is to determine the inter-relationships between the cracking of film, its structure and mechanical properties and to assess the toughness of thin film. Correlations between the formation of cracks, the mechanical properties of film and substrate, structure of film and macrostress a generated in the film during its growth were investigated in detail. It was found that the resistance of the film to cracking increases with increasing ratio H-f(3)/E-f*(2). It was found that (1) the correct assessment of toughness of the;hin film requires to investigate the system thin film/substrate as one unit because mechanical properties of the substrate play a decisive role in the formation of cracks, (2) the strongest parameter influencing the formation of cracks is the film structure and its macrostress alpha and (3) nanostructured films with X-ray amorphous structure and small compressive macrostress (sigma approximate to -0.1 GPa) are very stable against the cracking even at high values of the film hardness Hf exceeding 20 GPa. (C) 2006 Elsevier B.V. All rights reserved.