Diffusion bonding of boron nitride on metal substrates by plasma activated sintering (PAS) process
Diffusion bonding of boron nitride on metal substrates by plasma activated sintering (PAS) process
复制标题
通过等离子体激活烧结 (PAS) 工艺将氮化硼扩散键合到金属基材上
DOI：
10.1016/1359-6462(96)00008-5
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发表时间：
1996
期刊：
影响因子：
--
通讯作者：
K. Yamazaki
中科院分区：
文献类型：
--
作者：
S. Yoo;J. Groza;T. Sudarshan;K. Yamazaki
陶瓷涂层在高温下可用作金属材料的热屏障，提高金属材料的耐腐蚀性和耐磨性，具有广阔的应用前景。特别是，BN陶瓷具有优异的耐腐蚀性和耐磨性、低的导热系数和较高的温度稳定性，是热障材料的优秀候选材料。总体而言，1273K以上的陶瓷具有比金属或高温合金更好的强度、蠕变氧化性能。众所周知，由于陶瓷和金属之间的原子键不同，陶瓷涂层很难在金属衬底上应用。为了提供预期的保护，金属陶瓷涂层必须提供良好的界面结合、适当的附着力和界面稳定性。这些可以通过不同的处理方法来实现，例如：加压扩散连接、热喷涂或机械连接。另一种方法是使用粉末冶金技术，例如热等静压(HIP)，当陶瓷粉末同时烧结和粘结到金属衬底上时，可以使用烧结粘结。本工作的目的是验证等离子辅助烧结(PAS)工艺在烧结BN陶瓷层的同时，在其与金属衬底之间形成良好的扩散连接的潜力。与热等静压技术相比，PAS中的烧结和涂层可以在非常短的时间内(几分钟而不是几个小时)完成，同时还可以通过去除表面氧化物或捕获气体来观察到(尚未证明)粒子表面的清洁能力。
Ceramic coatings have a considerable potential to be used as thermal barriers and improve corrosion and wear resistance of metallic materials at high temperatures. In particular, BN ceramics are excellent candidates for thermal barrier materials because they have superior corrosion and abrasion resistance, low thermal conductivity and high temperature stability. In general, above 1,273 K ceramics have better strength, creep oxidation resistance than metals or superalloys. It is well known that ceramic coatings are difficult to apply on metal substrates due to the different atomic bonding between ceramic and metals. To provide the expected protection, ceramic coating of metals must provide good interfacial bonding, suitable adherence and interface stability. These may be achieved by different processing approaches such as: diffusion bonding under pressure application, thermal spray or mechanical bonding. An alternative method may be sinter-bonding using P/M techniques such as hot isostatic pressing (HIP) when simultaneous sintering of ceramic powders and bonding onto the metal substrate can take place. The purpose of this present work is to verify the potential of the plasma assisted sintering (PAS) process to develop a good diffusion bonding between a BN ceramic layer and the metal substrate while sintering the ceramic layer. In contrast to HIP techniques, sintering and coating in PAS can be completed in a very short time (minutes as compared to hours) concurrent with an observed (not yet demonstrated) capability of particle surface cleaning by removing surface oxides or trapped gases.