Conductive adhesive materials for lead solder replacement
Conductive adhesive materials for lead solder replacement
复制标题
用于替代铅焊料的导电粘合剂材料
DOI：
10.1109/pep.1997.656476
复制
发表时间：
1997
期刊：
影响因子：
--
通讯作者：
M. Komagata
中科院分区：
文献类型：
--
作者：
K. Suzuki;O. Suzuki;M. Komagata
从接触电阻和粘合强度的角度，测试了用于MLC电容器和IC的各种粘合剂作为铅焊料替代物。还测量了I-V特性和频率特性。整体上，接触电阻取决于每种粘合剂的体积电阻率。不同的终端和凸块材料给出了不同的接触电阻值。特别是，镀锡端子往往会产生更高的接触电阻。粘合剂的类型、电极、终端和凸块材料也会影响粘合强度。虽然Ni填充的粘合剂具有良好的粘合强度并且不引起电迁移，具有较高的体积电阻率，但是其在小电流下提供良好的I-V特性。
Various adhesives were tested for MLC capacitors and ICs as lead solder replacements from the viewpoints of contact resistance and adhesion strength. I-V and frequency characteristics were also measured. On the whole, the contact resistance depended on the volume resistivity of each adhesive. Different termination and bump materials gave different contact resistance values. In particular, Sn plated terminations tended to give higher contact resistance. The adhesion strength was also influenced by the types of adhesives, and the electrode, termination and bump materials. Although Ni filled adhesive, which had good adhesion strength and did not cause electromigration, had higher volume resistivity, it gave good I-V characteristics at low current.