STEAM: A fast compact thermal model for two-phase cooling of integrated circuits
STEAM: A fast compact thermal model for two-phase cooling of integrated circuits
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STEAM：用于集成电路两相冷却的快速紧凑热模型
DOI：
10.1109/iccad.2013.6691127
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发表时间：
2013
期刊：
影响因子：
--
通讯作者：
J. Thome
中科院分区：
文献类型：
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作者：
A. Sridhar;Yassir Madhour;David Atienza Alonso;T. Brunschwiler;J. Thome
通过直接蚀刻在硅芯片上的微通道对计算机芯片进行两相液体冷却是一种潜在的长期解决方案，可以实现高性能多处理器的持续集成。两相冷却是指通过在散热器内流动的制冷剂的蒸发来去除热量。虽然该技术拥有卓越的冷却特性，但由于缺乏能够准确预测两相冷却 IC 温度的热建模工具，该技术在业界的大规模使用受到限制。在本文中，我们提出了 STEAM，这是一种用于 2D/3D IC 的新型紧凑热模型，通过硅微通道进行两相冷却。 STEAM 模型的准确性根据之前文献中报道的真实两相冷却 IC 测试堆栈的测量结果进行了验证。均匀热通量预测温度的平均误差低至 10.2%，热点预测的平均误差低至 6.9%。最后，将STEAM模型应用于具有两相冷却的真实3D多处理器片上系统（3D MP-SoC），以模拟IC温度和制冷剂泵送功率，展示了STEAM在近期具有两相冷却的高性能计算机的早期设计中的适用性。
Two-phase liquid cooling of computer chips via microchannels etched directly on silicon dies is a potential long-term solution to enable continued integration of high-performance multiprocessors. Two-phase cooling refers to the heat removal via evaporation of a refrigerant flowing inside a heat sink. While possessing superior cooling properties, large-scale use of this technology in the industry is limited by the lack of thermal modeling tools that can accurately predict temperatures in a two-phase cooled IC. In this paper, we propose STEAM, a new compact thermal model for 2D/3D ICs with two-phase cooling via silicon microchannels. The accuracy of the STEAM model is validated against measurements from a real two-phase cooled IC test stack reported previously in literature. Temperatures were predicted with an average error as low as 10.2% for uniform heat fluxes and 6.9% for hotspots. Finally, the STEAM model is applied to a realistic 3D multiprocessor system-on-chip (3D MP-SoC) with two-phase cooling to simulate IC temperatures and the refrigerant pumping power, demonstrating the applicability of STEAM in the early-stage design of near-future high-performance computers with two-phase cooling.