SURFACE CHANGES DURING AC ETCHING OF ALUMINUM
SURFACE CHANGES DURING AC ETCHING OF ALUMINUM
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DOI：
10.1149/1.2127408
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发表时间：
1981-01-01
影响因子：
3.9
通讯作者：
ALWITT, RS
中科院分区：
文献类型：
--
作者：
DYER, CK;ALWITT, RS
交流电流对铝的电化学腐蚀产生了高密度的立方体腐蚀坑，覆盖着一层氧化物或氢氧化物。给出了金属和薄膜结构的显微照片，并提出了一个模型来解释观察到的现象。计算表明，在较高的阴极电流密度下，从酸性溶液中沉积薄膜是可行的。一个重要的特征是靠近金属表面的高铝盐浓度阻碍了质子的流动。交流电流的电化学腐蚀被用来获得用于电解电容器电极的铝箔的高表面积，并且获得适合于铝光刻的粗糙表面。交流蚀刻的特点是粗糙金属的深度均匀，蚀刻层内存在一层氧化物或氢氧化膜。推测这一膜的沉积是由于阴极半周期(1)引起的局部pH的增加。在高温(2，3)的氯化物溶液中，用直流电腐蚀的铝的外观主要是隧道结构，交流腐蚀看不到这种结构。尽管交流蚀刻在商业上已经使用了25年以上，但除了最近的一篇论文提供了沉积薄膜的证据外，科学文献中没有讨论过它(1)。本工作展示了在有限的实验条件下刻蚀结构和伴生膜的出现和发展。计算结果表明，在较高的阴极电流密度(Cd)下，从酸性溶液中沉积薄膜是可行的。
Electrochemical etching of AI with alternating current produces a high density of cubic etch pits covered with a film of oxide or hydroxide. Micrographs of the metal and film structures are presented and a model is proposed to explain the observations. Calculations demonstrate the feasibility of film deposition from acid solution when a high cathodic current density is applied. A critical feature is that the high aluminum salt concentration near the metal surface hinders proton mobility.Electrochemical etching with alternating current is used to obtain a high surface area on A1 foil for electrolytic capacitor electrodes and also to obtain a roughened surface sUitable for aluminum lithographic plates. Ac etching is characterized by a uniform depth of roughened metal and by the presence of a film of oxide or hydroxide within this etched layer. This film is presumed to deposit because of the increase in local pH caused by the cathodic half-cycle (1). The tunnel structures that dominate the appearance of A1 etched with direct current in chloride solutions at high temperature (2, 3) are not seen with ac etching. Although ac etching has been used commercially for over 25 years it has not been discussed in the scientific literature except for a recent paper which presented evidence for the deposited film (1). The present work shows the appearance and development of the etch structure and accompanying film under a limited set of experimental conditions. Calculations demonstrate the feasibility of film deposition from acid solution when a high cathodic current density (CD) is applied.