Controlling Interfacial Ion-Transport Kinetics Using Polyelectrolyte Membranes for Additive- and Effluent-free, High-Performance Electrodeposition
Controlling Interfacial Ion-Transport Kinetics Using Polyelectrolyte Membranes for Additive- and Effluent-free, High-Performance Electrodeposition
复制标题
使用聚电解质膜控制界面离子传输动力学，实现无添加剂、无废液的高性能电沉积
DOI：
10.1021/acsami.1c03608
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发表时间：
2021
影响因子：
9.5
通讯作者：
H. Yanagimoto
中科院分区：
文献类型：
--
作者：
K. Akamatsu;S. Nakano;K. Kimura;Y. Takashima;T. Tsuruoka;H. Nawafune;Y. Sato;J. Murai;H. Yanagimoto
开发高性能、环保的电沉积工艺对于新兴涂层技术至关重要，因为当前技术使用高度复杂的镀液，其中含有金属盐、支持电解质和各种有机添加剂，从环境和成本角度来看，这都存在问题。在这里，我们证明夹在电极之间的200μm薄聚电解质膜通过界面渗透有效地浓缩金属离子，从而将电极之间的电导提高到0.30S，并实现不产生雾、污泥甚至废水的固态电沉积。实验结果和理论计算都表明，电沉积是由溶液/聚电解质界面上的离子渗透控制的，提供了与传统扩散控制电沉积本质上不同的离子传输机制。该装置包含 0.50 mol L–1 硫酸铜且不含任何添加剂，可提供 300 mA cm–2 的最大电流密度，比当前含有有机添加剂的商用电镀浴高出近五倍。
The development of high-performance, environmentally friendly electrodeposition processes is critical for emerging coating technologies because current technologies use highly complex baths containing metal salts, supporting electrolytes, and various kinds of organic additives, which are problematic from both environmental and cost perspectives. Here, we show that a 200 μm-thin polyelectrolyte membrane sandwiched between electrodes effectively concentrates metal ions through interfacial penetration, which increases the conductance between the electrodes to 0.30 S and realizes solid-state electrodeposition that produces no mist, sludge, or even waste effluent. Both, experimental results and theoretical calculations, reveal that electrodeposition is controlled by ion penetration at the solution/polyelectrolyte interface, providing an intrinsically different ion-transport mechanism to that of conventional diffusion-controlled electrodeposition. The setup, which includes 0.50 mol L–1copper sulfate and no additives, delivers a maximum current density of 300 mA cm–2, which is nearly fivefold higher than that of a current commercial plating bath containing organic additives.