Application of a Micromechanical Test Structure to the Measurement of Stress in an Electroplated Permalloy Film
Application of a Micromechanical Test Structure to the Measurement of Stress in an Electroplated Permalloy Film
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微机械测试结构在电镀坡莫合金薄膜应力测量中的应用
DOI：
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发表时间：
2009
期刊：
影响因子：
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通讯作者：
A. Walton
中科院分区：
文献类型：
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作者：
S. Smith;N. Brockie;J. Terry;N. Wang;A. Horsfall;A. Walton
悬浮式微旋转测试结构旨在测量表面微机械加工薄膜的应力，已应用于厚层电镀坡莫合金（NiFe 合金）的生产。该工艺对于磁性 MEMS 元件和器件的生产具有特别重要的意义。表征此类材料中的应力极其重要，特别是当这些薄膜用于具有底层集成电路的晶圆上时，因为众所周知，晶体管的匹配可能会受到晶体管上方互连特征引起的机械应变的影响。设计并制造了一种新的测试芯片，以确定坡莫合金应力传感器结构的最佳尺寸。
Suspended microrotating test structures designed to measure the stress in thin, surface micromachined films have been applied to the production of thick layers of electroplated permalloy (NiFe alloy). This process has particular significance to the production of magnetic MEMS components and devices. It is extremely important to characterise the stress in such materials, especially where these films are to be used on wafers with underlying integrated circuitry as it is well known that the matching of transistors can be affected by mechanical strains induced by interconnect features running above them. A new test chip has been designed and fabricated in order to determine the optimum dimensions for permalloy stress sensor structures.