On-Chip Air-Gapped Cavity Resonators and Filters for mm-Wave IC Applications

On-Chip Air-Gapped Cavity Resonators and Filters for mm-Wave IC Applications
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DOI:
10.1109/tcpmt.2016.2606161
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发表时间:
2016-09
期刊:
IEEE Transactions on Components, Packaging and Manufacturing Technology
影响因子:
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通讯作者:
Yang Tian;Hong Wang;Kokyan Lee;K. Ang
Yang Tian;Hong Wang;Kokyan Lee;K. Ang
中科院分区:
其他
文献类型:
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作者:
Yang Tian;Hong Wang;Kokyan Lee;K. Ang

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本文介绍了硅基毫米波集成电路谐振腔和滤波器的详细设计、制作和测量。利用Ansoft高频结构仿真软件进行了谐振腔和滤波器的设计。腔体谐振器和滤波器的制作在一个4英寸的硅衬底上使用的空气间隙微同轴技术,这是基于多层低温铜大马士革工艺。所制造的空腔谐振器已测得的空载质量(Qu)值分别为666和864 36和60 GHz。双极点带通腔体滤波器在36GHz和60GHz通带内的插入损耗接近0dB,回波损耗优于20dB。该谐振器和滤波器结构简单,避免了设计中过多的全局优化。因此,设计的精度、时间和复杂度可以显著提高。该制作工艺具有超低损耗和色散、完美的阻抗匹配、纯横向电磁传播模式、高隔离度和功率处理能力等优点。此外,该工艺具有低热预算,并与CMOS后端工艺(BEOL)完全兼容,可以与其他空气间隙微同轴组件集成,以实现高性能的微波片上系统。
This paper presents the detailed design, fabrication, and measurement of cavity resonators and filters for silicon (Si)-based millimeter-wave integrated circuits. The design of the cavity resonators and filters is conducted using Ansoft High Frequency Structure Simulator. The cavity resonators and filters are fabricated on a 4-in Si substrate using the air-gapped microcoax technology, which is based on a multilayer low-temperature copper Damascene process. The fabricated cavity resonators have measured unloaded quality (Qu) values of 666 and 864 for 36 and 60 GHz, respectively. Two-pole bandpass cavity filters have achieved an insertion loss close to 0 dB and a return loss better than 20 dB for both 36and 60-GHz passbands. The cavity resonator and filter have simple structures and avoided excessive global optimization for the design. Hence, the accuracy, time, and complexity of the design can be improved significantly. The fabrication technology demonstrates the advantages of ultralow loss and dispersion, perfect impedance matching, pure transverse electromagnetic propagation mode, and ultrahigh isolation and power-handling capability. Furthermore, the process has a low thermal budget and is fully compatible with CMOS back-end-of-line (BEOL) process, which can be integrated with other air-gapped microcoaxial components to realize a high-performance microwave system on chip.