Wide bandgap composite EBG substrates
Wide bandgap composite EBG substrates
复制标题
宽带隙复合EBG基板
DOI：
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发表时间：
2003
期刊：
影响因子：
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通讯作者：
X. Gong
中科院分区：
文献类型：
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作者：
W. Chappell;X. Gong
高K陶瓷被嵌入到聚合物主体中以创建电磁带隙(EBG)衬底，该衬底在阻带宽度、每层衰减和实用性方面具有比以前的带隙实现更好的性能。陶瓷周期性地间隔在基于特氟龙的商用主机中，以产生跨度从12.1到24.1 GHz的带隙。微型介质棒在单独的挤压过程中被创造出来，然后被放置在衬底中的正方形格子中，以产生周期性的复合材料。作为该材料的应用，在20.41 GHz处产生了缺陷谐振器，测得Q值为760。
High-K ceramics are embedded into a polymer host to create an electromagnetic bandgap (EBG) substrate that possess superior properties to previous bandgap implementations in terms of stopband width, attenuation per layer, and practicality. Ceramics are periodically spaced in a commercially-available, Teflon-based host to create a bandgap that spans from 12.1 to 24.1 GHz. Miniature dielectric rods were created in a separate extrusion process, and then placed in a square lattice in a substrate to create the periodic composite. As an application of the material, a defect resonator was created at 20.41 GHz and a Q of 760 was measured.