Effect of bending stiffness on the peeling behavior of an elastic thin film on a rigid substrate.
Effect of bending stiffness on the peeling behavior of an elastic thin film on a rigid substrate.
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DOI：
10.1103/physreve.91.042401
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发表时间：
2015-04
期刊：
影响因子：
--
通讯作者：
Zhilong Peng;Shaohua Chen
中科院分区：
文献类型：
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作者：
Zhilong Peng;Shaohua Chen
实验观察到刚性基底上弹性薄膜的最大剥离力并不总是出现在稳态剥离阶段，有时会出现在初始剥离阶段，受此启发，本文建立了一个理论模型，该模型不仅考虑了薄膜弯曲刚度对剥离力的影响，而且考虑了整个剥离过程，从脱粘开始到稳态阶段，其特征在于。在整个剥离过程中，再现了典型的剥离力-位移曲线和薄膜变形轮廓。对于具有相对大的弯曲刚度的膜的情况，发现最大剥离力出现在初始剥离阶段，并且膜的刚度越大，最大剥离力越大。随着剥离距离的增加，剥离力从最大值减小到稳态阶段的一个常数。对于具有相对小的刚度的膜的情况下，剥离力在初始阶段单调增加，然后在稳态阶段达到恒定的最大值。此外，在稳态阶段的剥离力与经典的肯德尔模型进行了比较。所有的理论预测与现有的实验和数值观察，可以准确地预测的最大剥离力，无论是什么样的薄膜的刚度是一致的。本文的研究结果对膜-基界面的设计和评价具有一定的指导意义。
Inspired by the experimental observation that the maximum peeling force of elastic films on rigid substrates does not always emerge at the steady-state peeling stage, but sometimes at the initial one, a theoretical model is established in this paper, in which not only the effect of the film's bending stiffness on the peeling force is considered, but also the whole peeling process, from the initiation of debonding to the steady-state stage, is characterized. Typical peeling force-displacement curves and deformed profiles of the film reappear for the whole peeling process. For the case of a film with relatively large bending stiffness, the maximum peeling force is found arising at the initial peeling stage and the larger the stiffness of the film, the larger the maximum peeling force is. With the peeling distance increasing, the peeling force is reduced from the maximum to a constant at the steady-state stage. For the case of a film with relatively small stiffness, the peeling force increases monotonically at the initial stage and then achieves a constant as the maximum at the steady-state stage. Furthermore, the peeling forces in the steady-state stage are compared with those of the classical Kendall model. All the theoretical predictions agree well with the existing experimental and numerical observations, from which the maximum peeling force can be predicted precisely no matter what the stiffness of the film is. The results in this paper should be very helpful in the design and assessment of the film-substrate interface.