Air-Gap Technology With a Large Void-Fraction for Global Interconnect Delay Reduction
Air-Gap Technology With a Large Void-Fraction for Global Interconnect Delay Reduction
复制标题
具有大空隙率的气隙技术可减少全局互连延迟
DOI：
10.1109/ted.2021.3105086
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发表时间：
2021
影响因子：
3.1
通讯作者：
M. Chan
中科院分区：
文献类型：
--
作者：
Clarissa C. Prawoto;Zichao Ma;Ying Xiao;S. Raju;M. Chan
以降低总线延迟和功耗为目标，介绍了一种用于上层互连的气隙技术。的制造过程中进行了讨论，利用<inline-formula><tex-math notation="LaTeX">${h}$</tex-math></inline-formula>-BN作为气隙覆盖层，使大空隙。空气间隙技术集成到上层后端线（BEOL）互连的适用性进行评估的空隙率相邻线间距。电气测量表明，邻线电容减少了50%。机械可靠性通过高于BEOL要求的杨氏模量来确保。使用疏水覆盖层防止水分吸收到气隙中。根据14纳米技术节点的参数，在最坏情况的交换场景中，全球总线中的气隙集成可使延迟和串扰减少41%和60%。它允许一个72%的能量延迟产品与优化设计的中继器减少。对于相同的延迟，在空气间隙的全局总线中的功耗通过需要少<inline-formula><tex-math notation="LaTeX">4倍的</tex-math></inline-formula>中继器而降低。
With a goal of delay and power reduction in global buses, an air-gap technology for upper-layer interconnect is introduced. The fabrication process is discussed, utilizing <inline-formula> <tex-math notation="LaTeX">${h}$ </tex-math></inline-formula>-BN as an air-gap capping layer to enable large voids. The suitability of an air-gap technology for integration into the upper-layer back-end-of-line (BEOL) interconnect is evaluated in terms of the void ratio to the adjacent-line spacing. Electrical measurements show that adjacent-line capacitance is reduced by 50%. Mechanical reliability is ensured by Young’s modulus above BEOL requirement. Moisture uptake into air gaps is prevented using a hydrophobic capping layer. The integration of air gaps in global buses results in a 41% and 60% reduction in delay and crosstalk in the worst case switching scenario, based on parameters in the 14-nm technology node. It allows a 72% reduction in the energy-delay product with optimally designed repeaters. For the same delay, power consumption in an air-gapped global bus is reduced by requiring <inline-formula> <tex-math notation="LaTeX">$4\times $ </tex-math></inline-formula> fewer repeaters.