3D Hierarchical Porous Cu-Based Composite Current Collector with Enhanced Ligaments for Notably Improved Cycle Stability of Sn Anode in Li-Ion Batteries
3D Hierarchical Porous Cu-Based Composite Current Collector with Enhanced Ligaments for Notably Improved Cycle Stability of Sn Anode in Li-Ion Batteries
复制标题
具有增强韧带的 3D 分层多孔铜基复合集流体可显着提高锂离子电池中锡阳极的循环稳定性
DOI：
10.1021/acsami.8b04049
复制
发表时间：
2018
影响因子：
9.5
通讯作者：
Zhu Min
中科院分区：
文献类型：
--
作者：
Luo Zheng;Xu Jincheng;Yuan Bin;Hu Renzong;Yang Lichun;Gao Yan;Zhu Min
用于锂离子电池的三维多孔Cu集流器由于能够容纳较大的体积膨胀，可以提高具有高比容量的锡阳极的循环性能。然而，纯Cu韧带过于柔软，无法承受足够的体积膨胀应力，从而导致三维多孔结构的破裂或裂缝的形成而导致容量的快速衰减。在本研究中，通过一步法对Cu-34Zn-6Al （wt %）前驱体进行脱合金处理并随后进行热处理，制备了一种具有增强韧带的新型微纳三维分层多孔cu基复合集流器。采用x射线衍射、扫描电镜和透射电镜研究了合金在渗合金和热处理过程中的孔隙和微观组织演变。为了验证三维多孔Cu/β/γ复合集流器的有效性，将Sn直接化学镀在其上，并与多孔纯Cu和普通Cu箔进行比较。结果表明，与镀锡三维多孔Cu集流器和平面铜箔相比，镀锡三维多孔Cu/β/γ复合集流器的循环稳定性得到了显著提高。
A 3D porous Cu current collector used in Li-ion batteries can improve the cycling performance of Sn anodes with high specific capacity because of the accommodation of large volume expansion by the pores. However, the pure Cu ligament is too soft to endure enough stress from volume expansion, and then it leads to the fast fade of capacity because of the formation of cracks or the collapse of the 3D porous structure. In this study, a novel micro-nano 3D hierarchical porous Cu-based composite current collector with enhanced ligaments has been fabricated by one-step dealloying of the Cu–34Zn–6Al (wt %) precursor and subsequent heat treatment. The pore and microstructure evolutions during dealloying and heat treatment have been studied by X-ray diffraction, scanning electron microscopy, and transmission electron microscopy. To confirm the validity of the 3D porous Cu/β/γ composite current collector, Sn has been directly electroless plated on it in comparison with the porous pure Cu and the common Cu foil. It is found that the Sn-coated 3D hierarchical porous Cu/β/γ composite current collector with higher hardness shows significantly improved cycling stability compared with the Sn-coated 3D porous Cu current collector and the planar copper foil.