Multi-Material ALE with AMR for Modeling Hot Plasmas and Cold Fragmenting Materials
Multi-Material ALE with AMR for Modeling Hot Plasmas and Cold Fragmenting Materials
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具有 AMR 的多材料 ALE，用于模拟热等离子体和冷碎片材料
DOI：
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发表时间：
2015
期刊：
影响因子：
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通讯作者：
A. Bertozzi
中科院分区：
文献类型：
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作者：
A. Koniges;N. Masters;A. Fisher;D. Eder;Wangyi Liu;R. Anderson;D. Benson;A. Bertozzi
我们开发了一种新的三维多物理多材料程序ALE-AMR，它结合了任意拉格朗日欧拉流体力学(ALE)和自适应网格加密(AMR)来连接连续统和微结构区域。该程序的独特之处在于它能够模拟热辐射等离子体和冷碎裂固体。新的数值技术被开发出来，使许多物理程序包在动态移动和自适应的网格上有效地工作。采用基于混合区内物质组分体积分数的界面重构方法，并根据需要进行界面重构。该界面重构模型也适用于孔洞的合并和破碎。灵活的强度/失效框架允许可插拔的材料模型，这可能需要材料历史阵列来确定J2塑性模型中累积损伤的级别或演变的屈服应力。对于某些应用，激光通过虚拟复合网格传播，该虚拟复合网格由建模空间的最精细分辨率表示组成。对热传导和辐射输运程序实现了一种新的二阶精确扩散求解器。一个应用领域是激光/目标效应的建模，包括碎片/弹片的产生。其他应用领域包括热致密物质、EUV光刻和聚变设备的材料壁相互作用。
We have developed a new 3D multi-physics multi-material code, ALE-AMR, which combines Arbitrary Lagrangian Eulerian (ALE) hydrodynamics with Adaptive Mesh Refinement (AMR) to connect the continuum to the microstructural regimes. The code is unique in its ability to model hot radiating plasmas and cold fragmenting solids. New numerical techniques were developed for many of the physics packages to work efficiently on a dynamically moving and adapting mesh. We use interface reconstruction based on volume fractions of the material components within mixed zones and reconstruct interfaces as needed. This interface reconstruction model is also used for void coalescence and fragmentation. A flexible strength/failure framework allows for pluggable material models, which may require material history arrays to determine the level of accumulated damage or the evolving yield stress in J2 plasticity models. For some applications laser rays are propagating through a virtual composite mesh consisting of the finest resolution representation of the modeled space. A new 2nd order accurate diffusion solver has been implemented for the thermal conduction and radiation transport packages. One application area is the modeling of laser/target effects including debris/shrapnel generation. Other application areas include warm dense matter, EUV lithography, and material wall interactions for fusion devices.