Cleaning of thick viscoplastic soil layers by impinging water jets
Cleaning of thick viscoplastic soil layers by impinging water jets
复制标题
通过冲击水射流清洁厚粘塑性土壤层
DOI:
10.1016/j.jfoodeng.2022.111290
复制
发表时间:
2023
影响因子:
5.5
通讯作者:
Chee M
中科院分区:
文献类型:
--
作者:
Chee M
The removal of thick (approximately 1–10 mm) layers of three viscoplastic soft-solid food-related materials (a moisturising cream, Biscoff® spread and smooth peanut butter) from polymethylmethacrylate plates by turbulent, coherent, 2 mm diameter water jets was studied for jet velocities of 10.6–25.4 m s−1(10 500 <Re< 25 400). When the layer thickness was smaller than the nozzle diameter, soil removal involved the growth of a circular crater. With thicker layers, the removed soil initially formed a blister which subsequently ruptured, and removal by cratering followed. Blister formation and dynamics were studied for the moisturising cream using 2 mm and 3 mm nozzles, which indicated that this process could be described by simple geometric models. Tests with the moisturising cream on glass and stainless steel substrates indicated little effect of substrate on the removal behaviour. The rate of removal in the cratering regime was quantified by the kinetic model of Glover et al. (2016) and the effect of layer thickness on the kinetic parameters compared with the trend predicted by the model of Fernandes and Wilson (2020): qualitative agreement was evident. The results were used to revisit the study of blister formation by water jets impinging on Carbopol® layers reported by Tuck et al. (2019, 2020) and extract kinetic parameters from their data.
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影响因子:
2.7
作者:
S. Sen;Anthony G. Morales;R. Ewoldt
通讯作者:
R. Ewoldt
影响因子:
4.6
作者:
Brendan C. Blackwell;Marc E. Deetjen;Joseph E. Gaudio;R. Ewoldt
通讯作者:
R. Ewoldt
影响因子:
4.6
作者:
A. Rodgers;G. de Boer;B. Murray;G. Scott;N. Kapur
通讯作者:
N. Kapur
DOI:
--
发表时间:
2020
期刊:
影响因子:
--
作者:
M. Chee;D. Wilson
通讯作者:
D. Wilson
DOI:
--
发表时间:
2019
期刊:
Chemical Engineering and Science
影响因子:
--
作者:
Jifeng Yang;R. Bhagat;R. Fernandes;Mikkel Nordkvist;K. Gernaey;U. Krühne;D. Wilson
通讯作者:
D. Wilson