Microstructure and properties of the laser butt welded 1.5-mm thick T2 copper joint achieved at high welding speed
Microstructure and properties of the laser butt welded 1.5-mm thick T2 copper joint achieved at high welding speed
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高焊接速度下激光对焊1.5mm厚T2铜接头的显微组织和性能
DOI：
10.1016/j.matdes.2015.09.072
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发表时间：
2015-12
影响因子：
8.4
通讯作者：
Zhang, Jian-Xun
中科院分区：
文献类型：
--
作者：
Zhang, Gui-Feng;Ning, Jie;Zhang, Xing-Jun;Zhang, Jian-Xun
铜等高反射材料的激光焊接长期以来一直存在飞溅、底部填充和底切等问题。这项工作分析了相关机理，并提出，通过以略低于指定激光功率下全熔透焊接的临界焊接速度的高焊接速度进行焊接工艺，可以改善激光焊接铜接头的外观和完整性。对高焊接速度下获得的T2铜接头的显微组织、力学性能和导电率进行了测试。结果表明，铜接头与母材（BM）的导电率相近，焊缝熔合区（FZ）和热影响区（HAZ）软化；接头的拉伸强度和伸长率分别比 BM 低约 20% 和 84%。接头在FZ中心沿焊接方向生长的纵向柱状晶结构（LC）与FZ其他区域垂直于焊接方向生长的水平柱状晶结构（HC）之间的界面附近发生断裂。铜接头机械性能下降的原因是加热区软化以及LC和HC生长方向之间的大角度。
Laser welding of highly reflective materials, such as copper, has suffered problems such as spatter, underfill and undercut for a long time. This work analyzed the associated mechanism and suggested that appearance and integrity of laser welded copper joint could be improved by conducting the welding process at a high welding speed which is slightly below the critical welding speed for full-penetration welding at the specified laser power. The microstructure, mechanical properties and electrical conductivity of the T2 copper joint achieved under high welding speed were tested. Results show that copper joint and base material (BM) have similar electrical conductivity, the weld fusion zone (FZ) and the heat affected zone (HAZ) are softened; the tensile strength and elongation of the joint are approximately 20% and 84% below those of the BM respectively. The joint breaks near the interface between the longitudinal columnar grain structures (LC) growing along welding direction at the FZ center, and the horizontal columnar grain structures (HC) growing perpendicular to the welding direction at other area of FZ. Degradation of the mechanical properties of copper joint is attributed to the softening of the heated zone and the big angle between the growth directions of LC and HC.
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DOI：
10.1016/j.jmatprotec.2014.03.016
发表时间：
2014-08-01
影响因子：
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