Voltammetric Detection of the DNA Interaction with Copper Complex Compounds and Damage to DNA
Voltammetric Detection of the DNA Interaction with Copper Complex Compounds and Damage to DNA
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DOI：
10.1002/(sici)1521-4109(199902)11:2
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发表时间：
1999-02
期刊：
影响因子：
3
通讯作者：
J. Labuda;M. Bučková;M. Vaníčková;J. Mattusch;R. Wennrich
中科院分区：
文献类型：
--
作者：
J. Labuda;M. Bučková;M. Vaníčková;J. Mattusch;R. Wennrich
用伏安法研究了1，10-邻菲咯啉（phen）和四氮杂大环配体TAAB的铜（II）配合物与小牛胸腺DNA在裸玻碳电极和DNA修饰玻碳电极上的结合反应。的结合常数，结合位点的大小，结合常数的还原和氧化的铜络合物的形式，以及信息的静电和嵌入结合模式的比率的值，通过溶液和表面为基础的方法获得。Cu（phen）22+络合物介导的dsDNA切割的程度高于Cu（TAAB）2+，如氧化还原标记Co（phen）33+和DNA碱基的阳极信号所示。提出了一种利用dsDNA/GCE生物传感器检测DNA损伤的方法。
Binding reactions of copper(II) complexes of 1,10-phenanthroline (phen) and tetraaza macrocyclic ligand TAAB with calf thymus DNA have been investigated voltammetrically at bare and DNA modified glassy carbon electrodes. The values of binding constant, binding site size, ratio of binding constants for the reduced and oxidized copper complex forms as well as information on the electrostatic and intercalative binding modes were obtained by solution and surface-based methods. The Cu(phen)22+complex mediates the dsDNA cleavage to a higher degree than Cu(TAAB)2+as indicated by the redox marker Co(phen)33+and the anodic signal of the DNA base. A procedure for the damage to DNA detection using dsDNA/GCE biosensor is proposed.