Material microstructure effects in micro-endmilling of Cu99.9E
Material microstructure effects in micro-endmilling of Cu99.9E
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DOI：
10.1177/0954405416666898
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发表时间：
2018-05-01
期刊：
影响因子：
2.6
通讯作者：
Rosochowski, A.
中科院分区：
文献类型：
--
作者：
Elkaseer, A. M.;Dimov, S. S.;Rosochowski, A.
本文研究了微观尺度上冶金和机械改性材料的加工响应。对平均晶粒尺寸为30μm的粗晶Cu99.9E和平均晶粒尺寸为200nm的超细晶Cu99.9E进行了微铣削槽试验，采用等通道角压制法生产。提出了一种基于原子力显微镜测量的新方法，用于评估材料均匀性变化对具有最小表面粗糙度的稳健微切削工艺所需的最小切屑厚度的影响。研究表明，通过细化材料微观结构，可以减小最小切屑厚度并获得高表面光洁度。此外，还得出结论，材料均匀性的提高可以减少微切削中的表面粗糙度和表面缺陷。
This article presents an investigation of the machining response of metallurgically and mechanically modified materials at the micro-scale. Tests were conducted that involved micro-milling slots in coarse-grained Cu99.9E with an average grain size of 30 mu m and ultrafine-grained Cu99.9E with an average grain size of 200nm, produced by equal channel angular pressing. A new method based on atomic force microscope measurements is proposed for assessing the effects of material homogeneity changes on the minimum chip thickness required for a robust micro-cutting process with a minimum surface roughness. The investigation has shown that by refining the material microstructure the minimum chip thickness can be reduced and a high surface finish can be obtained. Also, it was concluded that material homogeneity improvements lead to a reduction in surface roughness and surface defects in micro-cutting.