Strength evaluation of lead-free-solder joint fabricated by reactive film local heating
Strength evaluation of lead-free-solder joint fabricated by reactive film local heating
复制标题
反应膜局部加热无铅焊点的强度评估
DOI：
10.1109/sensor.2009.5285537
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发表时间：
2009
期刊：
影响因子：
--
通讯作者：
S. Inoue
中科院分区：
文献类型：
--
作者：
K. Ootani;Y. Yamano;T. Namazu;S. Inoue
研究了银锡（Ag-Sn）焊点单晶硅（SCS）试样的粘接强度。利用铝-镍（Al/Ni）多层膜中的放热反应作为熔解焊料膜的热源。该反应产生的热量足以熔化Ag-Sn薄膜[1]。为了测量SCS试件的焊接强度，研制了微型试件四点弯曲试验机。在空气和真空条件下，将结合后的SCS薄片切割成具有Ag-Sn/AlNi/Ag-Sn截面的矩形固体试样。断裂强度随压力载荷的增大而增大。真空粘接试样的强度高于空气粘接试样。
This paper focuses on evaluating the adhesive strength of silver-tin (Ag-Sn) solder-jointed single-crystal silicon (SCS) specimens. The exothermic reaction in aluminum-nickel (Al/Ni) multilayer film was used as a heat source for melting the solder film. The reaction generated heat enough to melt Ag-Sn film [1]. To measure the adhesive strength of solder-jointed SCS specimens, we developed the four-point bending tester for minute specimens. The rectangular-solid SCS specimens having an Ag-Sn/AlNi/Ag-Sn section were prepared by dicing the bonded SCS wafer under various pressure loads in air and vacuum. As a result, fracture strength increased with an increase of pressure load. The strength of specimens bonded in vacuum was higher than that bonded in air.