Exchange coupling in nanostructured CoO/NiFe networks
Exchange coupling in nanostructured CoO/NiFe networks
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DOI:
10.1103/physrevb.64.184430
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发表时间:
2001-10
影响因子:
3.7
通讯作者:
Li Sun;Yang Ding;C. Chien;P. Searson
中科院分区:
文献类型:
--
作者:
Li Sun;Yang Ding;C. Chien;P. Searson
oO a When an antiferromagnetic ~AF!/ferromagnetic~FM! bilayer is cooled below the AF Ne ́el temperature ( TN) in the presence of a magnetic field larger than the saturation fiel the ferromagnet, the interfacial interactions between the materials will induce a unidirectional exchange anisotro which shifts the magnetic hysteresis loop of the ferromag from the zero-field axis. 1–3 The magnitude of the displace ment is usually referred to as the exchange bias HE , which can be defined as 2(H left1H right)/2, whereH left and H right are the two external fields at zero magnetization. In addit to the shift of the hysteresis loop, the coercivi HC@2(H left2H right)/2)] in the coupled layers is alway found to be enhanced compared to a single FM layer. In this paper, we show that significant enhancements the exchange bias can be achieved in nanostructured AF CoO/NiFe bilayers fabricated by deposition onto porous a mina templates. The as-deposited films have an interc nected network structure, and exhibit significant enhan ments in bothHE and HC compared to uniform exchang coupled thin films. The coercivity of films with different FM layer thicknesses decreases quasilinearly with increa temperature, and the exchange field is inversely proportio to the FM layer thickness when it is larger than 40 nm. T enhancements inHC and HE compared to the continuou films are attributed to domain confinement and pinning in FM and AF network structures. To study the thickness dependence of the exchange pling in the network structure, and allow a comparison continuous films and uncoupled NiFe networks, three ty of samples, were prepared: ~i! ~001! Si / NiFe wedge~4–78 nm!/CoO ~30 nm!/Cu ~2 nm!, ~ii ! Al2O3(d5200 nm)/ NiFe wedge ~4–78 nm!/CoO ~30 nm!/Cu ~2 nm!, and ~iii ! Al2O3(d5200 nm)/NiFe wedge~4–80 nm!/Cu ~2 nm!. The NiFe and CoO layers were deposited by dc and rf sputter respectively. The 2-nm Cu layer was sputtered to cap FM/AF bilayer. The continuously varying NiFe layer thick ness enabled us to study samples grown under iden deposition conditions, with the thickness being the only va able. The growth rates of the different materials were c brated by profilometer as well as small angle x-ray diffra tion. The alumina templates ~Whatman! have an average pore diameter of 200 nm with pseudohexagonal order The average wall thickness at the surface was 40 nm. Figure 1 shows a plan view scanning electron microsc