Oxidation behavior and intermetallic compound growth dynamics of SAC305/Cu solder joints under rapid thermal shock
Oxidation behavior and intermetallic compound growth dynamics of SAC305/Cu solder joints under rapid thermal shock
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DOI：
10.1016/s1003-6326(23)66317-4
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发表时间：
2023-10
影响因子：
4.5
通讯作者：
Ming Wu;Shan-lin Wang;Li-meng Yin;Yuhua Chen;Min Hong;Wen-jun Sun;Zong-xiang Yao;Jia-ming Ni-Jia
中科院分区：
文献类型：
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作者：
Ming Wu;Shan-lin Wang;Li-meng Yin;Yuhua Chen;Min Hong;Wen-jun Sun;Zong-xiang Yao;Jia-ming Ni-Jia
