Dynamics of dislocation interactions with stacking-fault tetrahedra at high temperature
Dynamics of dislocation interactions with stacking-fault tetrahedra at high temperature
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DOI：
10.1016/j.jnucmat.2012.10.004
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发表时间：
2013-02
影响因子：
3.1
通讯作者：
M. Briceno;J. Kacher;I. Robertson
中科院分区：
文献类型：
--
作者：
M. Briceno;J. Kacher;I. Robertson
利用透射电子显微镜在高温下原位变形实验中，真实的观察了位错与大型层错四面体的相互作用过程。位错与四面体的相互作用导致它们被湮灭并转化为另一种缺陷类型。位错绕过四面体发生交叉滑移。后一种相互作用发生缓慢，并阻止了脱位的进展。通过位错交叉滑移的湮灭与旁路由滑移面包围四面体的位置决定-在表面上或沿着具有阶梯棒位错的边缘。一般来说，相互作用，充其量，是弱温度依赖性。
The interaction process between dislocations and large stacking-fault tetrahedra was observed in real time at high temperature during deformation experiments in situ in the transmission electron microscope. Dislocation interactions with tetrahedra resulted in them being annihilated and converted to another defect type. Dislocation bypass of the tetrahedra occurred by cross-slip. The latter interaction occurred slowly and halted the progress of the dislocation. Annihilation versus bypass by dislocation cross-slip was dictated by the location at which the slip plane intersected the tetrahedron – on the face or along the edges with the stair-rod dislocations. In general, the interactions, at best, were weakly temperature dependent.