Vacuum packaging technology for mass production of uncooled IRFPAs
Vacuum packaging technology for mass production of uncooled IRFPAs
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DOI：
10.1117/12.822707
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发表时间：
2009-05
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通讯作者：
Takuya Ito;T. Tokuda;M. Kimata;Hideyuki Abe;Naotaka Tokashiki
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作者：
Takuya Ito;T. Tokuda;M. Kimata;Hideyuki Abe;Naotaka Tokashiki
我们开发了真空封装设备和低成本真空封装技术，用于大规模生产非制冷IRFPA。该设备由两个结构相同的室组成。两室架构为真空封装工艺提供了灵活性，因此我们可以在高真空条件下通过一系列加热、管帽焊接和帽窗焊接来烘烤元件并实现吸气剂激活。加热器和元件固定夹具由石墨制成，可确保快速均匀地加热至 500°C。如果我们选择15毫米直径的TO8封装，批量大小为27，并且可以通过扩大石墨加热器面积来增加批量大小。我们还开发了一种微真空计来评估封装封装中的真空水平。该真空计的工作原理是基于空气分子的热传导。由于制造工艺与 IRFPA 兼容，因此它可以集成在 IRFPA 芯片中。我们使用我们的真空封装设备将真空计封装在 TO8 封装中，并确认制造的封装中的压力足够低，可以使用微真空计进行高性能 IRFPA 操作 (<< 1 Pa)。
We developed vacuum packaging equipment and low-cost vacuum packaging technology for the mass production of uncooled IRFPAs. The equipment consists of two chambers with identical construction. Two-chamber architecture provides flexibility in the vacuum packaging process, so we can bake the components and achieve getter activation by heating, stem/cap soldering, and cap/window soldering in a series under high-vacuum conditions. Heaters and component-holding jigs are made of graphite to assure rapid and uniform heating to 500°C. The batch size is 27 if we choose a 15-mm diameter TO8 package and can be increased by enlarging the graphite heater area. We also developed a micro-vacuum gauge to evaluate the vacuum level in encapsulated packages. The operation principle of this vacuum gauge is based on thermal conduction by air molecules. It can be integrated in IRFPA chips since the fabrication process is compatible with that for IRFPAs. We encapsulated the vacuum gauges in TO8 packages with our vacuum packaging equipment, and confirmed that the pressure in fabricated packages is sufficiently low for high performance IRFPA operation (<< 1 Pa) with the micro-vacuum gauges.