Two-Dimensional Flex Sensor Exploiting Stacked Ultrathin Chips
Two-Dimensional Flex Sensor Exploiting Stacked Ultrathin Chips
复制标题
利用堆叠超薄芯片的二维柔性传感器
DOI：
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发表时间：
2012
影响因子：
4.9
通讯作者：
J. Burghartz
中科院分区：
文献类型：
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作者：
S. Endler;S. Ferwana;H. Rempp;C. Harendt;J. Burghartz
提出了一种机械柔性应力和挠曲传感器的新概念。利用两个MEMS芯片的堆叠来补偿热效应和垂直压阻效应。通过调整顶部管芯的厚度，底部芯片的有源器件得到应力补偿，而顶部芯片的器件接收最大应力。这种结构布置使得两个模具的表观垂直应力和温度基本相同。因此，两个管芯的差分信号提供关于2-D应力和挠曲的温度补偿信息。
A new concept for mechanically flexible stress and flex sensors is presented. A stack of two ultrathin chips is exploited to compensate both thermal effects and the vertical piezoresistive effect. By tailoring the thickness of the top die, the active devices of the bottom chip become stress compensated, whereas the devices of the top chip receive maximum stress. The structural arrangement enforces that the apparent vertical stresses and the temperatures of both dies are basically identical. Thus, the differential signal of both dies provides a temperature-compensated information about the 2-D stress and flexure.