Application of Magnetic Ferrite Electrodeposition and Copper Chemical Mechanical Planarization for On-Chip Analog Circuitry
Application of Magnetic Ferrite Electrodeposition and Copper Chemical Mechanical Planarization for On-Chip Analog Circuitry
复制标题
磁性铁氧体电沉积和铜化学机械平坦化在片上模拟电路中的应用
DOI：
10.1557/proc-869-d2.3
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发表时间：
2005
期刊：
影响因子：
--
通讯作者：
S. Kurinec
中科院分区：
文献类型：
--
作者：
C. Washburn;Daniel Brown;Jay Cabacungan;J. Venkataraman;S. Kurinec
电感器是模拟电路设计的重要元件，从匹配电路到无源滤波器。在这项研究中，已被研究的应用程序的结晶沉积的纳米铁氧体材料作为一种技术，以增加集成铜平面电感器的电感使用镀铜和化学机械平坦化制造。将烧结的锰锌铁氧体颗粒悬浮在含有硝酸镁和硝酸镧盐的异丙醇介质中。通过施加的电场辅助颗粒向基底表面的运输，并且通过基于甘油的表面活性剂将颗粒粘附到基底表面。电泳沉积工艺在p型硅衬底的表面上相对于铜选择性地形成自对准聚合物薄膜。这种铁氧体沉积方法对电感线圈和与标准硅技术兼容的图案化硅衬底产生高选择性。
Inductors are important components of analog circuit designs, from matching circuitry to passive filters. In this study, the application of electrophoretically deposited nano-ferrite material has been investigated as a technique to increase the inductance of integrated copper planar inductors fabricated using copper plating and chemical mechanical planarization. Sintered Mn-Zn ferrite particles are suspended in a medium of isopropyl alcohol with magnesium nitrate and lanthanum nitrate salts. The transportation of the particles to the substrate surface is assisted by applied electric field and particles adhere to the substrate surface by a glycerol based surfactant. Electrophorectic deposition process forms a self aligned polymeric thin film on the surface of a p-type silicon substrate selectively with respect to copper. This ferrite deposition method yields high selectivity to the inductor coils and patterned silicon substrates compatible with standard silicon technology.