Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints
Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints
复制标题
Ni改性多壁碳纳米管对Sn-3.0Ag-0.5Cu复合焊点微观结构演变和剪切强度的影响
DOI：
10.1016/j.matchar.2020.110287
复制
发表时间：
2020-05-01
影响因子：
4.7
通讯作者：
Jiang, Xiongxin
中科院分区：
文献类型：
--
作者：
Wang, Haozhong;Hu, Xiaowu;Jiang, Xiongxin
在锡-3.0Ag-0.5Cu(SAC305)焊料中添加不同含量的镍修饰多壁碳纳米管(MWCNTs)，制备了一种复合焊料。通过实验研究了复合焊点的热行为、力学性能，并对焊点的剪切断裂行为进行了评价。采用化学修饰的方法对多壁碳纳米管进行了改性处理，合成了镍修饰碳纳米管(Ni-CNTs)，并将其手工混入不同含量的SAC305焊粉中。随着镍碳纳米管含量的增加，复合焊料合金的熔点略有升高。纳米压痕结果表明，Ni-CNTs的加入提高了复合焊料合金的硬度和弹性系数。对焊点进行了时效试验，结果表明，镍碳纳米管作为SAC305焊料的添加剂，能有效地抑制焊点中IMC层的生长。SAC305-xNi-CNTs/Cu(x=0，0.1和0.2wt%)接头的剪切强度随Ni-CNTs加入量的增加而提高。此外，SAC305-0Ni-CNTs/Cu和SAC305-0.1Ni-CNTs/Cu焊点在焊点与IMC之间部分断裂，大部分在焊点基质之间断裂，SAC305-0.2Ni-CNTs/Cu焊点在焊点内部完全断裂。结果表明，随着NiCNTs含量的增加，焊点的断裂模式由混合型断裂模式向延性断裂模式转变。
A composite solder was prepared by adding different amount Ni modified multi-walled carbon nanotubes (MWCNTs) into the Sn-3.0Ag-0.5Cu (SAC305) solder. Experiments were conducted to investigate the thermal behavior, mechanical properties of composite solder alloys, shear fracture behavior of solder joints were evaluated as well. The modification process was carried out on the MWCNTs using electroless modification method to synthesis the Ni modified carbon nanotubes (Ni-CNTs), which was manually mixed into SAC305 solder powder with different amount. The melting point of the composite solder alloys was slightly increased with the increment of the amount of Ni-CNTs. The nanoindentation WA results confirmed that the hardness and modulus of composite solder alloys were enhanced after the addition of Ni-CNTs. The aging experiment was implemented for the joints and the results indicated that the Ni-CNTs could effectively inhibit the growth of IMC layer as an additive in SAC305 solder. The shear strength of SAC305-xNi-CNTs/Cu (x = 0, 0.1 and 0.2 wt%) joints was reinforced with the increment of Ni-CNTs amount. Furthermore, the SAC305-0Ni-CNTs/Cu and SAC305-0.1Ni-CNTs/Cu solder joints were broken partially between the solder and IMC, mostly between the solder matrix, and SAC305-0.2Ni-CNTs/Cu solder joint was broken completely inside solder matrix. It was suggested that the fracture mode of the solder joints changed from mix fracture mode to ductile fracture mode as the amount of NiCNTs increased.