Fracture modes in micropillar compression of brittle crystals
Fracture modes in micropillar compression of brittle crystals
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DOI：
10.1557/jmr.2011.256
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发表时间：
2012-01-01
影响因子：
2.7
通讯作者：
Clegg, William J.
中科院分区：
文献类型：
--
作者：
Howie, Philip R.;Korte, Sandra;Clegg, William J.
本文介绍了裂纹在微压缩的Si，InAs，MgO和MgAl2O4晶体，并与以前的观察Si和GaAs微柱进行比较。最常见的开裂模式是全厚度轴向开裂，裂纹从临界尺寸以上支柱中的交叉滑移带向下扩展。在所有这些材料中观察到的分裂行为与先前的分析定量一致，尽管不同材料之间的性质和滑移几何形状存在差异。滑移带上方的裂纹也发生在一些支柱的侧面或顶面。这些模式的开裂的驱动力进行了描述，并与观察比较。然而，只有通过厚度轴向分裂观察到的支柱的完全失败，因此，它被认为是最重要的，在确定已观察到的脆韧性转变。
This article describes cracking during microcompression of Si, InAs, MgO, and MgAl2O4 crystals and compares this with previous observations on Si and GaAs micropillars. The most common mode of cracking was through-thickness axial splitting, the crack growing downward from intersecting slip bands in pillars above a critical size. The splitting behavior observed in all of these materials was quantitatively consistent with a previous analysis, despite the differences in properties and slip geometry between the different materials. Cracking above the slip bands also occurred either in the side or in the top surface of some pillars. The driving forces for these modes of cracking are described and compared with observations. However, only through-thickness axial splitting was observed to give complete failure of the pillar; it is, therefore, considered to be the most important in determining the brittle-to-ductile transitions that have been observed.